2009 IEEE International Interconnect Technology Conference 2009
DOI: 10.1109/iitc.2009.5090332
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Building the human-chip interface

Abstract: This paper summarizes several interconnection issues related to brain-computer interfaces and neuroprosthetics. Siliconbased out-of-plane integration and interconnection to achieve partially-invasive brain-computer interfaces will be described.

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Cited by 3 publications
(5 citation statements)
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“…In this study, each probe comb contained 20 gold studs. Previous studies have used 16 [8], 20 [11], and 32 [14] recording electrodes per probe comb based on various packaging schemes. The gold studs facilitate electrical connections between the probe and gold traces on the Si platform during soldering.…”
Section: Design Conceptmentioning
confidence: 99%
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“…In this study, each probe comb contained 20 gold studs. Previous studies have used 16 [8], 20 [11], and 32 [14] recording electrodes per probe comb based on various packaging schemes. The gold studs facilitate electrical connections between the probe and gold traces on the Si platform during soldering.…”
Section: Design Conceptmentioning
confidence: 99%
“…Numerous 3D probe arrays have been recently demonstrated for recording neuronal activity [3][4][5][6][7][8][9][10][11][12][13][14][15]. These 3D probe arrays are implanted in the narrow space (subarachnoid space) between the pia mater and dura mater of the brain.…”
Section: Introductionmentioning
confidence: 99%
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“…2). The signal strength for this type is a bit weaker, but less risk of scar tissue formation (Aarts et al, 2009). o Non-invasive BCI: Non-invasive BCIs are based on the analysis of Electroencephalogram (EEG) phenomena.…”
Section: : Bss Schematic Diagrammentioning
confidence: 99%