Assembly of 3D probe array for wireless implantable neuroprobe microsystem

Yu, Aibing; Cheng, M.; Tan, Kwan-Ling; Giao, Teh Poh; Ramana, Murthy B.; Je, Minkyu

doi:10.1109/eptc.2010.5702732

Cited by 2 publications

(3 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This paper presents a microassembly method of a lowprofile probe array for chronic implantation. 2D multielectrode probes [14] are fabricated and assembled into the slim Si platform [15,16] to implement a 3D probe array. As a Si lead transfer structure, a Si interposer is introduced to overcome the bonding plane mismatch between the probe array and the ASIC.…”

Section: Introductionmentioning

confidence: 99%

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Cheng

Tan

et al. 2013

J. Micromech. Microeng.

View full text Add to dashboard Cite

This paper presents a microassembly method for low-profile three-dimensional probe arrays for neural prosthesis and neuroscience applications. A silicon (Si) lead transfer structure, Si interposer, is employed to form electrical connections between two orthogonal planes-the two dimensional probes and the dummy application-specific integrated circuit (ASIC) chip. In order to hold the probe array and facilitate the alignment of probes during assembly, a Si platform is designed to have through-substrate slots for the insertion of probes and cavities for holding the Si interposers. The electrical interconnections between the probes and the dummy ASIC chip are formed by solder reflow, resulting in greatly improved throughput in the proposed assembly method. Moreover, since the backbone of the probe can be embedded inside the cavity of the Si platform, the profile of the probe array above the cortical surface can be controlled within 750 μm. This low-profile allows the probe array not to touch the skull after it is implanted on the brain. The impedance of the assembled probe is also measured and discussed.

show abstract

Section: Introductionmentioning

confidence: 99%

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Cheng

Tan

et al. 2013

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…On the other hand, the Utah Electrode Array (UEA) consists of a 100-channel and IC are connected to it with AuSn flip-chip bonding and reflow soldering [7], [8]. The integrated package is therefore biocompatible, stable and also reliable for implantation.…”

Section: Introductionmentioning

confidence: 99%

“…The integrated package is therefore biocompatible, stable and also reliable for implantation. However, there is only one recording or stimulating sites in each electrode [7]. This would have significantly reduced the chances of recording or stimulating any neural activities in the motor cortex.…”

Section: Introductionmentioning

confidence: 99%

Integration of low profile neural probe array with flexible polyimide cable

Ling

Cheng

Giao

et al. 2011

2011 IEEE 13th Electronics Packaging Technology Conference

View full text Add to dashboard Cite

In this work, an integration method of low profile probe array system is proposed for minimizing the tissue trauma after implantation. The planar neural probes was assembled with a Si platform to form a 3D probe array, which is then connected to the application-specific integrated circuit (ASIC) chip with a flexible polyimide cable by flip-chip bonding to complete the whole integration. The probe array and flexible polyimide cable have undergone electrical tests to prove to be highly stable and reliable. With the specially designed components, flexible assembly is achieved. The proposed integration method achieved a low profile of the probe array and the requirements for its applications. The impedance of the assembled probe electrode in artificial cerebrospinal fluid (aCSF) is measured to be about 1.1 MΩ at 1kHz.

show abstract

Assembly of 3D probe array for wireless implantable neuroprobe microsystem

Cited by 2 publications

References 9 publications

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Integration of low profile neural probe array with flexible polyimide cable

Contact Info

Product

Resources

About