“…It is interesting to find out the factors that dominate wire splitting. It was reported that the tip-to-substrate Joule heating current above 1 μA in C-AFM may result in a temperature increase of 100−500 °C based on the heat flow equation, , Δ T = 0.5 P o /π KR where P o is the average power dissipated around the contact, K is the thermal conductivity, and R is the spherical contact radius. Assuming that all of the power P dissipated around the contact, and using the values of R from a few nanometers (for surface protrusions) to 20 nm (for smooth surface; typical tip radius), and K = 130 W/(m·K) for GaN in our case, we obtained Δ T ≪ 1 °C in our case.…”