1985
DOI: 10.1063/1.335562
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Calculation of surface generation and recombination velocities at the Si-SiO2 interface

Abstract: Using deep level transient spectroscopy in the current transient mode, the interface trap density and electron and hole capture cross sections have been measured for thermally oxidized 〈100〉 silicon. We have compared oxides grown with and without HCl in the growth ambient, and also investigated the effect of the postoxidation inert ambient anneal. Values of the depleted surface generation velocity and surface recombination velocities in low- and high-level injection were then calculated from the measured inter… Show more

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Cited by 184 publications
(73 citation statements)
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“…As device sizes get smaller, the surface-area-to-volume ratio increases, and custom control over the surface chemistry is required in order to optimize the desired performance. For example, untreated subsurface oxidation often compromises the performance of electronic devices [1][2][3] and optical sensors 4,5 and is particularly important for small devices such as nanowires. 6 Chemical modification 7,8 is used to form surfaces of high electrical quality that resist oxide growth.…”
Section: Introductionmentioning
confidence: 99%
“…As device sizes get smaller, the surface-area-to-volume ratio increases, and custom control over the surface chemistry is required in order to optimize the desired performance. For example, untreated subsurface oxidation often compromises the performance of electronic devices [1][2][3] and optical sensors 4,5 and is particularly important for small devices such as nanowires. 6 Chemical modification 7,8 is used to form surfaces of high electrical quality that resist oxide growth.…”
Section: Introductionmentioning
confidence: 99%
“…Active photonic devices rely heavily on III-V materials because of their proficiency for controlling optical processes 8 , yet etching small III-V structures debilitates material quality because of III-V compounds' sensitivity to surface conditions 9 . While SiO 2 offers remarkable surface passivation properties for silicon 10 , a comparable solution for III-V semiconductors remains absent. On the other hand, low-defect single-crystal nanostructures can be grown with atomically flat surfaces and in situ surface passivation via higher band gap cladding layers 11,12 , which have historically proven to provide the best passivation for III-V materials.…”
mentioning
confidence: 99%
“…The recombination losses of charge carriers on Si interfaces are mainly controlled by surface charge and the density and energetic distribution of rechargeable states D (E) [24]. As recently reported, the texturization of polished silicon substrates by anisotropic etching leads to a strong increase of crystallographic surface irregularities, resulting in a high density of rechargeable states, resulting in high recombination losses on structured interfaces.…”
Section: Monitoring Of Preparation-induced Surface Electronic Propertmentioning
confidence: 85%