Challenges in Stacked CSP Packaging Technology

Oh, Boon Howe; Loo, Howe Yin; Oh, Poh Tat; Lee, Eng Kwong

doi:10.1109/emap.2006.4430609

Cited by 5 publications

(2 citation statements)

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“…Studies have also shown that bonding at different locations of the overhang results in different bending stresses and deflection [11]. Many studies have been conducted which investigates the effect of changing the overhang length on die stress and deflection [10]- [13]. The studies highlighted above also investigated the effect of increasing die thickness on the stress and deflection of the die [10]- [13].…”

Section: Introductionmentioning

confidence: 99%

“…Many studies have been conducted which investigates the effect of changing the overhang length on die stress and deflection [10]- [13]. The studies highlighted above also investigated the effect of increasing die thickness on the stress and deflection of the die [10]- [13]. This study aims to determine the stress and deflection of a stacked die by changing the bonding positions instead of changing the dimensions of the overhang.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Finite Element Modeling of Copper Wire Bonding on a Stacked-Die in Semiconductor Devices

Tam¹,

Pasbakhsh²,

Guo³

et al. 2013

IJCTE

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Abstract-Finite element analysis of wire bonding on the overhang of a stacked-die was conducted. The stresses and deflection of the die was determined through the use of the commercially available solver ANSYS. In this study, the finite element model was used to simulate copper wire bonding on a stacked-die application. Copper with its higher hardness required more force to deform. The increase in force generates greater stresses on the die especially on the overhang region. This creates a scenario where the die is under a large amount of stress and may result in cracks. The study aims to determine the stresses and deflections of the die when bonding is carried out on the overhang of the die. It was discovered that the stresses and deflection of the die increases as the distance from the stacked die increases. The study also determined that increasing the thickness of the die leads to decrease in bending stress and deflection of the die.

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