In this work we present our results of an approach to assess material property changes with time due to high temperature ageing in an isotropic conductive adhesive. A molecular model of an epoxy with similar primary chemistry is investigated by molecular dynamics simulations. By variation of crosslink density, one supposed effect of ageing (post-curing) is investigated with respect to its impact on diffusivity of water molecules and the free volume of the epoxy matrix. In a simple submodel of a composite material, the portability of the results into FE simulations and their validity are discussed by comparison to experimental results