We have deposited hydrogenated, silicon/nitrogen-incorporated diamond-like carbon (Si–N-DLC) films by plasma-enhanced chemical vapor deposition using hexamethyldisilazane [((CH3)3Si)2NH; HMDS] as the Si and N source, and compared the tribological performance and thermal stability of the Si–N-DLC films with those of hydrogenated, Si-incorporated DLC (Si-DLC) films prepared using dimethylsilane [SiH2(CH3)2] as the Si source. The deposited films were annealed at 723–873 K in air atmosphere. The friction coefficients of hydrogenated DLC films after annealing significantly increased at the initial stages of friction tests. On the other hand, the friction coefficients of the Si–N-DLC films deposited at an HMDS flow ratio [HMDS/(HMDS+CH4)] of 2.27% remained low after the annealing even at 873 K. We found that the wear rate of the Si–N-DLC film deposited at 2.27% and −1000 V remained almost unchanged after the annealing at 873 K, whereas that of the Si-DLC film with a similar Si fraction deposited at −1000 V significantly increased after the annealing at 773 K.