2012 19th International Conference on Microwaves, Radar &Amp; Wireless Communications 2012
DOI: 10.1109/mikon.2012.6233597
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Characterization and modeling of low-cost, high-performance GaN-Si technology

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Cited by 13 publications
(9 citation statements)
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“…To accomplish this task, a straightforward approach based on a polynomial approximation of the noise correlation parameters is adopted. This noise modeling approach has already shown to be able to reproduce successfully the behavior of the noise (N-) parameters of microwave GaAs transistors without illumination [27][28][29][30][31][32]. The present study shows that this polynomial-based technique allows modeling N-parameters also under light exposure.…”
Section: Introductionmentioning
confidence: 55%
“…To accomplish this task, a straightforward approach based on a polynomial approximation of the noise correlation parameters is adopted. This noise modeling approach has already shown to be able to reproduce successfully the behavior of the noise (N-) parameters of microwave GaAs transistors without illumination [27][28][29][30][31][32]. The present study shows that this polynomial-based technique allows modeling N-parameters also under light exposure.…”
Section: Introductionmentioning
confidence: 55%
“…Finally, technological assessment was accomplished by the characterization and modeling of a set of monolithic passive components (inductors, capacitors, resistors, and transmission lines). Further details on the modeling of passive components and on a similar sample of active devices can be found in .…”
Section: Fabrication Process and Technology Assessmentmentioning
confidence: 99%
“…However, the reason why SiC is the preferred substrate material for GaN devices resides in its still superior performance: GaN-on-Si devices, indeed, show lower gain and noise behaviors. This is due to different issues, such as the higher Si losses, a lower Si thermal conductivity compared to the SiC one, and the bigger lattice mismatch GaN has with Si respect to SiC, which brings a higher density of impurities and vacancies in the crystalline structure of the devices [11,12].…”
Section: Introductionmentioning
confidence: 99%