Characterization of a wire bonding process with the added challenges from palladium-coated copper wires

Chang, Andrew; Lim, Adeline B.Y.; Lee, C. X.; Milton, Basil; Clauberg, Horst; Yauw, Oranna; Chylak, Bob

doi:10.1109/iemt.2012.6521834

Cited by 5 publications

(3 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It has a longer shelf life compared to bare copper wire due to the noble metal coating and is perceived to have better bond reliability under humid conditions [4,9]. Numerous studies on interfacial reaction and IMC formation between Cu and Al bond pads have been carried out [4][5][6][7][8][9][10][11]. It was reported that the IMC phases identified in the Cu/Al bond interface are typically CuAl 2 , CuAl and Cu 9 Al 4 ; the latter two IMCs are mostly found after thermal treatment [10].…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition

Lim

Neo

Yauw

et al. 2015

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

View full text Add to dashboard Cite

Copper wire has become a mainstream bonding material in fine-pitch applications due to the rising cost of gold wire. In recent years, palladium-coated copper (Pd-Cu) wire is being increasingly used to overcome some constraints posed by pure Cu wire. During wire bonding with aluminum bond pads, different intermetallic compound (IMC) phases that have been identified at the bond interface are typically CuAl 2 , CuAl and Cu 9 Al 4 . Copper wire bonds were reported to fail humidity reliability tests and Cu 9 Al 4 was observed to be the corroded IMC layer. However, the corrosion susceptibility of the individual IMCs has not been investigated. There has also been conflicting results on the effect of palladium on the reliability of copper wire bonds reported in literature. This paper compares the corrosion performance of the three types of Cu-Al IMCs in a chloride medium by employing electrochemical potentiodynamic polarization. A comparison was made with pure Cu and Al. The effect of Pd on the IMC corrosion performance was also studied. Among the three CuAl IMCs, Cu 9 Al 4 was observed to have the largest corrosion rate followed by CuAl 2 and CuAl. For the metals, Cu was observed to have the lowest corrosion rate and Al is the most easily corroded. The addition of a few percent of Pd slightly improves the corrosion resistance of the metals and IMCs.

show abstract

Section: Introductionmentioning

confidence: 99%

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition

Lim

Neo

Yauw

et al. 2015

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

View full text Add to dashboard Cite

show abstract

“…As electronic components continue to shrink and advanced devices require high pin counts, 0.6 mil fine palladium-coated copper wire is actively being qualified before being introduced into manufacturing production lines to accommodate such technological developments [6]. Assembly and packaging companies worldwide are known to use different wires from different manufacturers of their choice.…”

Section: Introductionmentioning

confidence: 99%

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Lim

Chang

Yauw

et al. 2014

Microelectronics Reliability

View full text Add to dashboard Cite

“…Fine copper and palladium-coated copper wires have been widely used in the electronic industry in recent years (1). As electronic components continue to shrink and advanced devices require high pin counts, 0.6 mil fine palladium-coated copper wire is actively being qualified before being introduced into manufacturing production lines to accommodate such technological developments (2). Assembly and Packaging companies worldwide are known to use different wires from different manufacturers of their choice, therefore there is a need to determine optimized FAB and bonded ball parameters for each wire type to maximize the wire bonding capabilities.…”

Section: Introductionmentioning

confidence: 99%

Palladium-Coated and Bare Copper Wire Study for Ultra-Fine Pitch Wire Bonding

et al. 2013

View full text Add to dashboard Cite

There is growing interest in copper (Cu) wire bonding due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. Recently, palladium-coated copper (PdCu) wire has become widely used as it is believed to improve reliability. In this paper, we experimented with 0.6 mil PdCu and bare Cu wires. Palladium distribution and grain structure of the PdCu Free Air Ball (FAB) were investigated. It was observed that Electronic Flame Off (EFO) current and the cover gas type have a significant effect on palladium distribution. The Free Air Ball (FAB) hardness was measured and correlated to palladium distribution and grain structure. First bond process responses were characterized. The impact of palladium on wire bondability and wire bond intermetallic using a high temperature storage test was studied. These results for PdCu wire were compared with bare Cu wire.

show abstract

Characterization of a wire bonding process with the added challenges from palladium-coated copper wires

Cited by 5 publications

References 4 publications

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Palladium-Coated and Bare Copper Wire Study for Ultra-Fine Pitch Wire Bonding

Contact Info

Product

Resources

About