Hafnium oxide and silicate materials are now incorporated into working CMOS devices; however, the crystallization mechanism is still poorly understood. In particular, addition of SiO 2 to HfO 2 has been shown to increase the crystallization temperature of HfO 2 , hence, allowing it to remain amorphous under current processing conditions. Building on earlier study, we herein, investigate bulk Hf x Si 1Àx O 2 samples to determine the effect of SiO 2 on the crystallization pathway. Techniques, such as XRD, HTXRD, thermal analysis techniques and TEM are used. It is found that the addition of SiO 2 has very little affect on the crystallization path at temperatures below 900°C, but at higher temperatures, a second t-HfO 2 phase nucleates and is stabilized due to the strain of the surrounding amorphous SiO 2 material. With an increase in SiO 2 content, the temperature at which this nucleation and stabilization occurs is increased. The effect of strain has implications for inhibiting the crystallization of the high-k layer, reduction of grain boundaries and hence diffusion, reduction of formation of interface layers and the possibility of stabilizing t-HfO 2 rather than m-HfO 2 , hence, increasing the dielectric of the layer.
R. Riedel-contributing editorManuscript No. 31334.