2004
DOI: 10.1016/j.jcrysgro.2003.12.009
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Characterization of hafnium silicate thin films grown by MOCVD using a new combination of precursors

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Cited by 34 publications
(29 citation statements)
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“…It has been reported that hafnia or zirconia is phase separated from silicates by thermal annealing at temperatures above 800°C for hafnium silicate and above 900°C for zirconium silicate. [28][29][30] This should reduce the intensity of the PL peculiar to silicates. Therefore, by assuming that the phase separation also occurred in HSA37 and ZSA15, the decrease in intensity for PLs ␥ HS and ␥ ZS by the thermal annealing can be explained.…”
Section: Resultsmentioning
confidence: 99%
“…It has been reported that hafnia or zirconia is phase separated from silicates by thermal annealing at temperatures above 800°C for hafnium silicate and above 900°C for zirconium silicate. [28][29][30] This should reduce the intensity of the PL peculiar to silicates. Therefore, by assuming that the phase separation also occurred in HSA37 and ZSA15, the decrease in intensity for PLs ␥ HS and ␥ ZS by the thermal annealing can be explained.…”
Section: Resultsmentioning
confidence: 99%
“…16͒ and comparable to Hf silicates. 17 It is, however, lower than for DyScO 3 and GdScO 3 . 10 Figure 3 shows the capacitance normalized to the gate area versus gate voltage for SmScO 3 films with different thicknesses.…”
mentioning
confidence: 82%
“…For example, silicon is introduced into HfO 2 films in order to improve the thermodynamic stability of HfO 2 in direct contact with silicon [8,9]. It is well known that hafnium silicate (HfSi x O y ) can avoid the formation of the low-κ interfacial oxide layer due to a high resistivity to oxygen diffusion [3,10,11]. Also, the formation of hafnium silicate helps stabilize an amorphous structure during high temperature annealing with enhanced interface carrier mobility [10][11][12][13][14].…”
Section: Introductionmentioning
confidence: 99%
“…It is well known that hafnium silicate (HfSi x O y ) can avoid the formation of the low-κ interfacial oxide layer due to a high resistivity to oxygen diffusion [3,10,11]. Also, the formation of hafnium silicate helps stabilize an amorphous structure during high temperature annealing with enhanced interface carrier mobility [10][11][12][13][14]. Although the overall permittivity of the hafnium silicate film is inevitably lower than that of the pure HfO 2 , this trade-off can be accepted to a certain extent for the improved stability.…”
Section: Introductionmentioning
confidence: 99%