The sections in this article are
Introduction
Gettering
Intrinsic Gettering
Gettering by Hydrogen Annealing
Device Isolation
LOCOS
‐Based Isolation
Advanced Isolation Techniques
Silicon‐on‐Insulator
Gate Dielectrics
Preoxidation Cleaning
Process Dependence of Gate Oxide Quality
Chemically Modified Gate Oxides
CVD
and Stacked Oxides
Shallow Junction Formation
Ion Implantation
Advanced Techniques for
p
+
‐
n
Junction Formation
Diffusion from Doped Deposited Layers
Gas Immersion Laser Doping
Gas Phase Diffusion
Plasma Immersion Ion Implantation
Metallization
Gate Electrodes
Contacts
Interconnections
Planarization for Multilevel Interconnections
Cluster Tool Technology
Advantages
Rapid Thermal Processing
In Situ Dry Cleaning
Interface Engineering
Gate Stack of Oxide and Oxynitride
Deposition of
DRAM
Storage Dielectrics
Selective Deposition Processes
Ultra‐Shallow Junction Formation
Integrated
CMOS
Processing Based on
RTP
Ge
x
Si
1−
x
/
Si
Heteroepitaxy by
RT
‐
CVD
Single‐Wafer Integrated Processing