Characterization of sputtered nichrome (Ni–Cr 80/20 wt.%) films for strain gauge applications

Kazi, Imam H.; Wild, Peter; Moore, T. N.; Sayer, M.

doi:10.1016/j.tsf.2005.10.077

Cited by 76 publications

(30 citation statements)

References 9 publications

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“…Therefore, various compositions of the NiCr alloys have been widely used in the sputtering of thin films, micro-electro components, panel display boards and optical storage media materials. 4,5) Powder metallurgy (P/M) methods offer two different types of materials with the objective of achieving higher strength, hardness and wear resistance etc. Conventional sintered P/M-parts usually have more than 5% porosity.…”

Section: Introductionmentioning

confidence: 99%

Improvement of Mechanical and Electrical Properties on the Sintered Ni–50 mass% Cr Alloys by HIP Treatment

Chang

Chen

Huang³

et al. 2013

Mater. Trans.

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This study investigated Ni50 mass% Cr alloys produced by the vacuum sintering and hot isostatic pressing (HIP) of powder metallurgy technology. The experimental results showed that the relative density of Ni50 mass% Cr alloys reached 98.67%, the apparent porosity decreased to 1.33%, transverse rupture strength (TRS) increased to 454.29 MPa and electrical resistivity decreased to 4.284 © 10 ¹4 ³·cm after 1345°C sintering for 1 h. Meanwhile, laminar eutectic precipitations appeared in the sintered Ni50 mass% Cr alloys. In addition, the relative density increased to 99.73%, the apparent porosity decreases to 0.27% and TRS was obviously enhanced to 1181.4 MPa after 1260°C 175 MPa 4 h HIP treatment. Moreover, the electrical resistivity decreased to 3.346 © 10 ¹4 ³·cm after the optimal HIP treatment. This study showed that the HIP process is effective in eliminating internal pores and improving the mechanical and electrical properties of the sintered Ni50 mass% Cr alloys, thus obtaining the high density and optimum properties of the sintered materials.

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Section: Introductionmentioning

confidence: 99%

Improvement of Mechanical and Electrical Properties on the Sintered Ni–50 mass% Cr Alloys by HIP Treatment

Chang

Chen

Huang³

et al. 2013

Mater. Trans.

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“…7, а, б, мають місце в плівкових стопах (рис. 8) [32][33][34] та напівпровіднико-вих плівках [35]. Результати, аналогічні [32,34], одержані також і нами на прикладі плівкових стопів Ni-Co [36].…”

Section: експериментальні результатиunclassified

Effect of the Tensosensitivity in Metal Film Materials

et al. 2007

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В огляді здійснено аналізу відомих літературних даних про явище тензое-фекту в тонких і товстих плівках металів, стопів або композиційних мате-ріялів з металевою основою. Розглянуто відомі напівклясичні та феноме-нологічні моделі для одно-і багатошарових плівкових систем, наведено ре-зультати їх апробації і вказано ступінь відповідности розрахункових і екс-периментальних результатів. Зроблено висновок про значну роль так нази-ваних деформаційних ефектів, врахування яких дає хороше узгодження з експериментальними даними. Проаналізовано найменш вивчене питання фізики тонких плівок про температурну залежність коефіцієнтів поздовж-ньої та поперечної тензочутливости. Наведено численні експериментальні результати, які підтверджують теоретичні висновки. Проаналізовано ріж-ні аспекти практичного застосування плівкових матеріялів як чутливих елементів тензодавачів.The analysis of literature results concerning tensoresistive effect in thin and thick films of metals, alloys or composite materials based on a metal is presented. Well-known semi-classical and phenomenological models for one-and multilayered film systems are considered, results of their testing are presented, and the degree of conformity of calculated results with experimental ones is specified. A conclusion is drawn concerning significant role of deformation effects, which are taken into account to give satisfactory conformity with experimental data. A least studied problem in physics of thin films concerning the temperature dependence of coefficients of longitudinal and transverse tensosensitivity is analysed. Numerous experimental results, which confirm theoretical conclusions, are presented. Different aspects of practical application of film materials as sensitive elements of strain sensors are analysed.В обзоре проведен анализ известных литературных данных по тензоэффек-ту в тонких и толстых пленках металлов, сплавов или композиционных материалов с металлической основой. Рассмотрены известные полукласси-ческие и феноменологические модели для одно-и многослойных пленоч-ных систем, приведены результаты их апробации и указана степень соот-

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“…[1][2][3][4] FPCBs can be applied to various electronic products, such as portable electronics and display modules etc., due to their many advantageous properties including lightness, small thickness, high glass transition temperature, and superior exibility. [5][6][7][8][9] On the other hand, RPCBs have a low cost, high packaging density, and considerably better established reliability data. Recently, electronics manufacturers have shown increasing interest in the development of electrical and mechanical bonding techniques of electrodes, between FPCBs and RPCBs.…”

Section: Introductionmentioning

confidence: 99%

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

Yoon

Jung

2016

Mater. Trans.

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In this study, electrodes on a exible printed circuit board (FPCB) and rigid printed circuit board (RPCB) were bonded together by thermo-compression (TC) bonding, using a Sn-3.0Ag-0.5Cu solder as an interlayer. In order to investigate the hygrothermal reliability of the TC bonded FPCB/RPCB joints, a temperature-humidity (TH) test of 85 C/85% relative humidity, and a 90 peel test, were conducted. The relationships between the TH treatment, peel strength, and failure analysis result were discussed. The peel strength signi cantly decreased as TH time increased. In contrast, a signi cant variation in electrical resistance was not observed during TH testing. Thin and uniform (Ni,Cu) 3 Sn 4 intermetallic compound (IMC) layers were formed at both FPCB/Sn-3.0Ag-0.5Cu/RPCB interfaces. After a TH test for 500 h, the thickness of the IMC layer was slightly increased. In the case of the joint without TH treatment, a fracture occurred at the polyimide of the FPCB. After the TH test, the degradation of the adhesion between the polyimide and Cu in the FPCB occurred, due to the hygrothermal treatment, resulting in a switch of failure mode, from a polyimide failure to a brittle polyimide/Cu interface failure. X-ray photoelectron spectroscopy (XPS) analyses showed that the decrease in C-O and C=O bond ratios caused a decrease in peel strength of the TC bonded FPCB-RPCB joints, after the TH test. When comparing the TH and HTS tests, the TH test signi cantly deteriorated the integrity of the TC bonded FPCB-RPCB joints.

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Characterization of sputtered nichrome (Ni–Cr 80/20 wt.%) films for strain gauge applications

Cited by 76 publications

References 9 publications

Improvement of Mechanical and Electrical Properties on the Sintered Ni–50 mass% Cr Alloys by HIP Treatment

Improvement of Mechanical and Electrical Properties on the Sintered Ni–50 mass% Cr Alloys by HIP Treatment

Effect of the Tensosensitivity in Metal Film Materials

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

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Characterization of sputtered nichrome (Ni–Cr 80/20 wt.%) films for strain gauge applications

Cited by 76 publications

References 9 publications

Improvement of Mechanical and Electrical Properties on the Sintered Ni&ndash;50 mass% Cr Alloys by HIP Treatment

Improvement of Mechanical and Electrical Properties on the Sintered Ni&ndash;50 mass% Cr Alloys by HIP Treatment

Effect of the Tensosensitivity in Metal Film Materials

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints

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Product

Resources

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Improvement of Mechanical and Electrical Properties on the Sintered Ni–50 mass% Cr Alloys by HIP Treatment

Improvement of Mechanical and Electrical Properties on the Sintered Ni–50 mass% Cr Alloys by HIP Treatment