Characterizations of Electrically Conductive Adhesives

Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics

“…2 Copper particles, 3,4 silver micro-akes, 5,6 silver nanorods, 7,8 functionalized carbon nanotubes, [9][10][11] silver plated graphite nanosheets, 12,13 silver nanowires, 14,15 and hexagonal boron nitride nanoparticles 16,17 have been used as electrically conductive llers to increase electrical conductivity. Epoxy, 10,11 silicone resin, 18,19 polyimide resin, 20,21 phenol-formaldehyde resin, 22,23 polyurethane, 24,25 and acrylic resin 26,27 together with diluents, 6,28 curing agents, 6,28 crosslinkers, 29,30 coupling agents, 6,28 preservatives, 31,32 toughening agents, 33,34 thixotropic agents, 35 photosensitizers and photoinitiators 36,37 have been used as matrix resins to improve mechanical strength and shorten curing time. Most of these ECAs are cured by heat at 120-150 C in 30-60 min or by ultraviolet rays in several to tens of minutes.…”

Conductive Adhesives as the Ultralow Cost RFID Tag Antenna Material

“…By seasoning a small quantity of the organic molecules (usually those which can form ligands with the metallic fillers) into the ECA formulations, the electrical resistivity of the ECAs can be drastically reduced. [14] The mechanism is rather complicated, which is supposed to be related to the red-ox process of the silver surface. Some of the SAM molecules exhibit a certain level of reducing property.…”

Gallium–Indium–Tin Liquid Metal Nanodroplet-Based Anisotropic Conductive Adhesives for Flexible Integrated Electronics

“…In comparison to conventional soldering technology, emerging electronically conductive adhesive joints present significant advantages for interconnecting packages of electronics due to their better creep resistance and lower processing temperatures. − In particular, anisotropic conductive adhesives (ACAs) have established their obvious superiority for fine-pitch and ultrafine-pitch assembly of electronic circuits. ACAs, with conductive particles uniformly dispersed in an insulating adhesive organic material, enable highly conductive vertical paths with simultaneous insulation between terminals in parallel. − Therefore, the risk of short-circuit formation between closely packed adjacent terminations could be eliminated, which is ideal for interconnections in microsize ‘flip chip’ integrated circuits, liquid crystal displays, and flexible electronics. ,,− …”