2000
DOI: 10.1016/s0022-0248(00)00429-2
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Chemical vapor deposition of silicon–germanium heterostructures

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Cited by 33 publications
(24 citation statements)
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“…The electronic band parameters, gaps, discontinuities and effective masses for heterointerfaces between compressively strained Ge 1−x Sn x and relaxed Ge have been computed at room temperature. From this preliminary and mendatory work, we conclude that pseudomorphic Ge 1-x Sn x alloys become direct band gap semiconductors at a Sn-fraction of 15 [19,20], Ge on insulator (GeOI) substrates formed by wafer bounding [21][22][23] or recent advances in the growth of germanium nanowire arrays by vapour-liquid-solid (VLS) and vapoursolid-solid (VSS) techniques [24]. In this work and on the basis of our previous results [25] on the electronic band parameters for GeSn strained, first we determined the band offsets at Ge 1−x Sn x /Ge strained (001)-oriented relaxed interfaces.…”
Section: Introductionmentioning
confidence: 76%
“…The electronic band parameters, gaps, discontinuities and effective masses for heterointerfaces between compressively strained Ge 1−x Sn x and relaxed Ge have been computed at room temperature. From this preliminary and mendatory work, we conclude that pseudomorphic Ge 1-x Sn x alloys become direct band gap semiconductors at a Sn-fraction of 15 [19,20], Ge on insulator (GeOI) substrates formed by wafer bounding [21][22][23] or recent advances in the growth of germanium nanowire arrays by vapour-liquid-solid (VLS) and vapoursolid-solid (VSS) techniques [24]. In this work and on the basis of our previous results [25] on the electronic band parameters for GeSn strained, first we determined the band offsets at Ge 1−x Sn x /Ge strained (001)-oriented relaxed interfaces.…”
Section: Introductionmentioning
confidence: 76%
“…In reference [24], we described the procedure of SiGe layers growth in details. At moderate growth temperature, a decrease of the adatoms mobility inhibits the formation of undulations of the SiGe layer [25] due to the Stranski-Krastanov growth mode or surface instabilities, leading to a low final surface roughness.…”
Section: Samplementioning
confidence: 99%
“…However, there are several restrictions for growing thick BL at low temperature by CVD, such as the decrease of the growth rate due to the dynamic hydrogen coverage [24] or the low adatoms mobility and the high defect density (about 10 5 -10 7 cm À 2 ) that lead to an increase of the root-mean-square surface roughness (RMS) with the deposited thickness [29,30]. Otherwise, the Si BL growth temperatures are usually 600 1C in the UHV-CVD mode or 700 1C in the LP-CVD mode [24].…”
Section: Samples B 1 and B 2 : Sige Ps/si Ht Bl/si (0 0 1)mentioning
confidence: 99%
“…There are various CVD designs depending on the different epitaxy requirements. For the growth of SiGe on Si substrates, ultra-high vacuum CVD [8][9][10], rapid thermal CVD, remote plasma-enhanced CVD [11], and other low pressure CVD techniques have been reported [12]. The apparatus used in this report, is low pressure CVD equipment, designed and built at Southampton University [15].…”
Section: Introductionmentioning
confidence: 99%
“…Meanwhile, 3D SiGe islands provides the possibility of enhanced sensitivity in the near-and mid-IR ranges. To produce 3D SiGe nanostructures, surface controlled reactions and nucleations must be considered and self-assembled growth, exploiting Ge surface segregation and strain relaxation under specific growth conditions and relatively low temperature [12,14].…”
Section: Introductionmentioning
confidence: 99%