Chip-level integration of RF MEMS on-chip inductors using UV-LIGA technique

Park, Daniel Sang-Won; Jeong, Youngkyun; Lee, Jeong; Jung, Sungyong

doi:10.1007/s00542-007-0532-9

Cited by 12 publications

(3 citation statements)

References 22 publications

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“…However, because of the prohibitive cost and access to x-ray synchrotron radiation, x-ray LIGA has seldom been used [27]. UV LIGA is a more cost-effective alternative with numerous diverse applications in the industry [52,53].…”

Section: Uv Ligamentioning

confidence: 99%

Advances in precision micro/nano-electroforming: a state-of-the-art review

Zhang

Gilchrist

2020

J. Micromech. Microeng.

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Micro/nano-electroforming has received considerable interest from various industry sectors as an advanced micro-manufacturing technique that offers high dimensional precision and replication accuracy. When tight feature tolerances and miniaturized geometries are required, electroforming provides unique advantages and cost-effective characteristics for fabrication. This paper firstly reviews the historical development of micro-electroforming, particularly within the past two decades. The fundamentals of electroforming and relevant applications are firstly discussed, and the common requirements are then proposed. Based on these requirements, we have focused on the processes of micro-electroforming from the ultraviolet lithography, electroplating, and moulding process to electroforming process characterization and optimization, bath compositions, agitation, and some hybrid processes. Progress from electrochemical micro/nano-manufacturing processes, such as 3D printing by electrodeposition and electrochemical wet stamping, is also included. The eventual nanocomposite electroforming is highlighted from the perspectives of the formation mechanism, deposition properties and relevant applications. Finally, a conclusion and future perspectives are presented. This review will demonstrate how the micro/nano-electroforming process can be further developed to meet the requirements of new product development from precision optics, micro/nano-moulding, high-performance coatings and future micro/nano-manufacturing.

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Section: Uv Ligamentioning

confidence: 99%

Advances in precision micro/nano-electroforming: a state-of-the-art review

Zhang

Gilchrist

2020

J. Micromech. Microeng.

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“…Theoretical limitations and fabrication constraints restrict performance and are closely related to quality factor, frequency bandwidth, and temporal response 31 – 34 . More recent innovative devices have demonstrated improved properties by utilizing approaches such as three-dimensional fabrication; 35 – 38 mechanically self-assembled coils 38 – 41 ; air-core or air-suspended coils 35 , 42 – 44 ; and alternative materials such as graphene, carbon, ZnO and others 45 – 49 . However, complex designs are not easily integrated into standard fabrication processes.…”

Section: Introductionmentioning

confidence: 99%

Nanofabricated high turn-density spiral coils for on-chip electromagneto-optical conversion

Bok,

Ashtiani,

Gokhale

et al. 2024

Microsyst Nanoeng

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Circuit-integrated electromagnets are fundamental building blocks for on-chip signal transduction, modulation, and tunability, with specific applications in environmental and biomedical micromagnetometry. A primary challenge for improving performance is pushing quality limitations while minimizing size and fabrication complexity and retaining spatial capabilities. Recent efforts have exploited highly involved three-dimensional synthesis, advanced insulation, and exotic material compositions. Here, we present a rapid nanofabrication process that employs electron beam dose control for high-turn-density diamond-embedded flat spiral coils; these coils achieve efficient on-chip electromagnetic-to-optical signal conversion. Our fabrication process relies on fast 12.3 s direct writing on standard poly(methyl methacrylate) as a basis for the metal lift-off process. Prototypes with 70 micrometer overall diameters and 49–470 nm interturn spacings with corresponding inductances of 12.3–12.8 nH are developed. We utilize optical micromagnetometry to demonstrate that magnetic field generation at the center of the structure effectively correlates with finite element modeling predictions. Further designs based on our process can be integrated with photolithography to broadly enable optical magnetic sensing and spin-based computation.

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“…SOS has low substrate loss due to high resistivity of sapphire and low capacitive coupling to the substrate and it has provided inductors with high Q-factor and SRF [12]. Post-processing technique from MEMS technology can be implemented to remove the substrate underneath the inductor or suspend the inductor above the substrate to reduce the substrate loss for an inductor [10,[13][14][15][16][17][18][19]. This shows that SOS and MEMS technologies can be used to design high Q-factor inductors operating in tens of GHz of operating frequencies.…”

Section: Introductionmentioning

confidence: 99%

Design and analysis of a 10GHz LC-VCO using MEMS inductor

et al. 2012

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This paper presents design and analysis of a 10GHz inductance-capacitance (LC)-Voltage-Controlled Oscillators (VCO) implemented with a very high quality (Q) factor on-chip Micro-Electro-Mechanical Systems (MEMS) inductor using 0.25µm silicon-on-sapphire (SOS) technology. A new symmetric topology of suspended MEMS inductor is proposed to reduce the length of the conductor strip and achieve the lowest series resistance in the metal tracks. This MEMS inductor has been suspended above the high resistivity SOS substrate to minimise the substrate loss and therefore, achieve a very high Q-factor inductor. A maximum Q-factor of 191.99 at 11.7GHz and Q-factor of 189 at 10GHz has been achieved for a 1.13nH symmetric MEMS inductor. The proposed inductor has been integrated with a VCO on the same substrate using the Metal layers in SOS technology removing the need for additional bond wire. The 10GHz LC-VCO has achieved a phase noise of -116.27dBc/Hz and -126.19dBc/Hz at 1MHz and 3MHz of offset frequency, respectively. It consumes 4.725mW of power from 2.5V supply voltage while achieving a Figure of Merit (FOM) of -189.5dBc/Hz.

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Chip-level integration of RF MEMS on-chip inductors using UV-LIGA technique

Cited by 12 publications

References 22 publications

Advances in precision micro/nano-electroforming: a state-of-the-art review

Advances in precision micro/nano-electroforming: a state-of-the-art review

Nanofabricated high turn-density spiral coils for on-chip electromagneto-optical conversion

Design and analysis of a 10GHz LC-VCO using MEMS inductor

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