Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)

Yoshikawa, Hiroshi; Kawasaki, Atsuko; Tomoaki,; Iiduka,; Nishimura, Yasushi; Tanida, Kazumasa; Akiyama, K.; Sekiguchi, Mutsuo; Matsuo, M.; Fukuchi, Satoru; Takahashi, K.

doi:10.1109/isscc.2009.4977515

Cited by 48 publications

(15 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For example, Toshiba has applied 3D integration to a CMOS image sensor camera module for mobile phones, achieving a 55% reduction in volume and a 36% reduction in footprint while satisfying high-speed I/O requirements for video, with the required data rate per pin as high as 130MB/s for VGA at 30fps and 650MB/s for 3.2Mpixel at 15fps [31]. Kim et al have joined a tier containing 64 CPU cores running at 277MHz with a tier containing 256K of SRAM; their system achieves a 63.8GB/s memory bandwidth [12].…”

Section: Motivation For 3d Securitymentioning

confidence: 99%

A 3-D Split Manufacturing Approach to Trustworthy System Development

Valamehr

Sherwood

Kastner

et al. 2013

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

View full text Add to dashboard Cite

NSF Not applicableApproved for public release; distribution is unlimited.Securing the supply chain of integrated circuits is of the utmost importance to computer security. In addition to counterfeit microelectronics, the theft or malicious modification of designs in the foundry can result in catastrophic damage to critical systems and large projects. In this Technical Report, we describe a 3D architecture that splits a design into two separate tiers: one tier that contains critical security functions is manufactured in a trusted foundry; another tier is manufactured in an unsecured foundry. We argue that a split manufacturing approach to hardware trust based on 3D integration is viable and provides several advantages over other approaches.Hardware-oriented security and trust, 3D integration, trustworthy system development, policy enforcement, cryptographic hardware, embedded systems security, malicious hardware, trusted foundries AbstractSecuring the supply chain of integrated circuits is of the utmost importance to computer security. In addition to counterfeit microelectronics, the theft or malicious modification of designs in the foundry can result in catastrophic damage to critical systems and large projects. In this Technical Report, we describe a 3D architecture that splits a design into two separate tiers: one tier that contains critical security functions is manufactured in a trusted foundry; another tier is manufactured in an unsecured foundry. We argue that a split manufacturing approach to hardware trust based on 3D integration is viable and provides several advantages over other approaches.

show abstract

Section: Motivation For 3d Securitymentioning

confidence: 99%

A 3-D Split Manufacturing Approach to Trustworthy System Development

Valamehr

Sherwood

Kastner

et al. 2013

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

View full text Add to dashboard Cite

show abstract

“…Since 3-D integration is an existing technology already used in industry [24,26], our work does not discuss the feasibility of 3-D integration but rather focuses on the security ramifications of a 3-D control plane.…”

Section: Motivation For 3-d Securitymentioning

confidence: 99%

“…Some potential applications include the stacking of DRAM or bigger caches directly onto the processor die to alleviate memory pressure [17] and designing stacked chips of multiple processors [2]. Toshiba has applied 3-D integration to a CMOS image sensor camera module for mobile phones, which they call a Chip Scale Camera Module (CSCM), achieving a significant reduction in size while satisfying high-speed I/O requirements [24]. The Toshiba work demonstrates that cost savings are possible with 3-D integration because passive components, which provide load matching between the chip and the camera, can be integrated into the chip.…”

Section: -D Integrationmentioning

confidence: 99%

Hardware assistance for trustworthy systems through 3-D integration

Valamehr

Tiwari

Sherwood

et al. 2010

Proceedings of the 26th Annual Computer Security Applications Conference

View full text Add to dashboard Cite

Hardware resources are abundant; state-of-the-art processors have over one billion transistors. Yet for a variety of reasons, specialized hardware functions for high assurance processing are seldom (i.e., a couple of features per vendor over twenty years) integrated into these commodity processors, despite a small flurry of late (e.g., ARM TrustZone, Intel VT-x/VT-d and AMD-V/AMD-Vi, Intel TXT and AMD SVM, and Intel AES-NI). Furthermore, as chips increase in complexity, trustworthy processing of sensitive information can become increasingly difficult to achieve due to extensive on-chip resource sharing and the lack of corresponding protection mechanisms. In this paper, we introduce a method to enhance the security of commodity integrated circuits, using minor modifications, in conjunction with a separate integrated circuit that can provide monitoring, access control, and other useful security functions. We introduce a new architecture using a separate control plane, stacked using 3-D integration, that allows for the function and economics of specialized security mechanisms, not available from a coprocessor alone, to be integrated with the underlying commodity computing hardware. We first describe a general methodology to modify the host computation plane by attaching an optional control plane using 3-D integration. In a developed example we show how this approach can increase Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. To copy otherwise, to republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. ACSAC '10 Dec. 6-10, 2010, Austin, Texas USA Copyright 2010 ACM 978-1-4503-0133-6/10/12 ...$10.00. system trustworthiness, through mitigating the cache-based side channel problem by routing signals from the computation plane through a cache monitor in the 3-D control plane. We show that the overhead of our example application, in terms of area, delay and performance impact, is negligible.

show abstract

“…Toshiba has mass-produced a Chip Scale Camera Module (CSCM), an image sensor for mobile handsets [44]. An implantable stacked retinal prosthesis chip is a medical application of 3-D integration [22].…”

Section: Related Workmentioning

confidence: 99%