CMOS high-speed I/Os - present and future

Lee, M.-J.E.; Dally, William J.; Farjad-Rad, R.; Ng, Hiok-Tiaq; Senthinathan, R.; Edmondson, John H.; Poulton, John W.

doi:10.1109/iccd.2003.1240940

Cited by 27 publications

(19 citation statements)

References 21 publications

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“…Relative to 6.25 Gb/s transceivers, this will reduce I/O related power dissipation, which is a major contributor to the overall power consumption in today's systems [8]. Calculations show that the ratio of I/O power to corepower will increase per chip technology generation with the reciprocal ratio of logic gate sizes [26].…”

Section: High-speed I/o Circuitsmentioning

confidence: 99%

Towards 100G packet processing: Challenges and technologies

Hermsmeyer

Song²,

Schlenk

et al. 2009

Bell Labs Tech. J.

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Section: High-speed I/o Circuitsmentioning

confidence: 99%

Towards 100G packet processing: Challenges and technologies

Hermsmeyer

Song²,

Schlenk

et al. 2009

Bell Labs Tech. J.

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“…This rate of reduction matches the feature size reduction of silicon. This is the power scaling that would be expected when an ASIC is limited by its I/O power consumption [28].…”

Section: Optical Interconnects For Routers and Switchesmentioning

confidence: 99%

Silicon photonic devices and integrated circuits

Dong¹,

Chen²,

et al. 2014

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Silicon photonic devices and integrated circuits have undergone rapid and significant progresses during the last decade, transitioning from research topics in universities to product development in corporations. Silicon photonics is anticipated to be a disruptive optical technology for data communications, with applications such as intra-chip interconnects, short-reach communications in datacenters and supercomputers, and long-haul optical transmissions. Bell Labs, as the research organization of Alcatel-Lucent, a network system vendor, has an optimal position to identify the full potential of silicon photonics both in the applications and in its technical merits. Additionally it has demonstrated novel and improved high-performance optical devices, and implemented multi-function photonic integrated circuits to fulfill various communication applications. In this paper, we review our silicon photonic programs and main achievements during recent years. For devices, we review highperformance single-drive push-pull silicon Mach-Zehnder modulators, hybrid silicon/III-V lasers and silicon nitrideassisted polarization rotators. For photonic circuits, we review silicon/silicon nitride integration platforms to implement wavelength-division multiplexing receivers and transmitters. In addition, we show silicon photonic circuits are well suited for dual-polarization optical coherent transmitters and receivers, geared for advanced modulation formats. We also discuss various applications in the field of communication which may benefit from implementation in silicon photonics.

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“…We are seeing 3D scaling today and it may modify the path by 2020 as well. Taking these factors into consideration and the work presented in [36] and [37], improvements are expected to be around 0.78x (22%) per year for processing (logic) and 0.9x (10%) per year for interconnects. These improvements are also not expected to be the same for all the areas in the network since the constraints are different.…”

Section: Equipment Power Consumption Improvements In 2020mentioning

confidence: 99%