Coffin-Manson based fatigue analysis of underfilled DCAs

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

“…Over the last two decades, many models have been developed to estimate the low-cycle fatigue life of SnPb eutectic solder joints [17][18][19][20][21][22][23][24][25][26][27]. Among these models, the crack initiation and growth model proposed by Darveaux in 1995 [28], and revised in 2000 [29], is one of the widely accepted models.…”

Reliability of Repetitively Avalanched Wire-Bonded Low-Voltage Discrete Power Trench n-MOSFETs

“…Reports in literature have used the Coffin-Manson relation to characterize wirebond reliability in thermo-mechanically cycled power devices [4,16]. The results in table .…”

“…Previous studies have investigated the impact of thermal cycling on the long-term structural integrity of the joints in wire-bonded power devices [3] and the structural integrity of direct-chip attach assemblies where silicon chips have different thermal expansion coefficients with laminated substrates [4]. Other studies have also been reported on automotive planar MOSFETs used in anti-lock braking systems that are subject to cyclical temperature excursions and thermo-mechanical stresses from current cycling [5].…”

Fluxless flip chip bonding with joint-in-via architecture

“…The joints survived thermal cycling conditions A and B and thermal shock condition D for 1000 and 700 cycles, respectively. Although the Au -PbSn bond strength was weak compared to eutectic solder, the joint passed the JEDEC reliability requirement, as the capillary underfill effectively redistributed the thermal stresses and reduced the localized stress on the joint [17,18]. Further assessment of the bonding technique was carried out to assess its bonding capability by only heating on JIV substrate.…”