Coffin-Manson fatigue model of underfilled flip-chips

Gektin, Vadim; Bar‐Cohen, Avram; Ames, Jennifer

doi:10.1109/95.623026

Cited by 73 publications

(31 citation statements)

References 16 publications

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“…As an effective solution, using low CTE of ACF materials mechanically couples the severely CTE mismatched chip and substrate and provides a significant enhancement in assembly reliability. This mechanical coupling between the die and the substrate reduces the strain in the ACF connections by additional load transfer through the shear stresses, thus enhancing the thermo-mechanical reliability of flip chip assembly [10][11][12]. From the rubber elasticity theory, there are four factors affecting the ACF elasticity [13,14].…”

Section: Thermo-mechanical Propertiesmentioning

confidence: 99%

Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs

Hwang¹

2008

Microelectronics Reliability

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Section: Thermo-mechanical Propertiesmentioning

confidence: 99%

Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs

Hwang¹

2008

Microelectronics Reliability

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“…One of the drawbacks with use of Coffin Manson model is that it fails to capture the relationship among the parameters like frequency, temperature, and lead stiffness, which has limited its applicability to various problems related to failure/reliability of solder joints. [21] On the basis of experimental fatigue data presented by R.N. Wild for 63Sn37Pb solder joints used for interconnecting leadless devices on printed wiring boards, Engelmaier proposed a failure model, [22] …”

Section: Coffin Manson Modelmentioning

confidence: 99%

“…[21] Solder joints are known to fail in fatigue by cyclic strain induced by fluctuations in temperature under operational and environmental loading conditions.…”

Section: Coffin Manson Modelmentioning

confidence: 99%

Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics

Khanna

McCluskey

Manno

et al. 2015

Volume 10: Micro- And Nano-Systems Engineering and Packaging

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Thermal management has become increasingly important to ensuring the reliability of power electronics components due to the continuing increase of device power and integration levels. New approaches to provide the necessary thermal management include the development of embedded two-phase cooling systems. However, the reliability of such devices and that of their integration into the power electronics package have yet to be studied. This thesis details a Physics of Failure (PoF) based structural reliability analysis of novel 3-D integrated thermal packaging for next generation Power Electronics. The cooling technology aims to combine two-phase embedded manifold microchannel cooling in thin film evaporation mode with thermoelectric hot-spot cooling using a high conductivity Mini-contact. This study will focus on thermo-mechanical stress analysis of three different Mini-contact structures, micro-fin structure and reliability prediction of solder joint at various levels in Power Electronics package based on Engelmaier's failure model for SAC 305.

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“…7) In order to minimize the amount of stress from thermal cycling, an ideal underfill resin should have a CTE close to solder or slightly higher than the CTE of the solder. 8) However, CTE is considered to be less important factor than adhesion or modulus in terms of a contribution to the stress redistribution. 6) The reliability of BGA assembly is highly dependent on the material properties of underfill resin.…”

Section: Introductionmentioning

confidence: 99%

Bonding Characteristics of Underfilled Ball Grid Array Packaging

Yim

Lee

et al. 2015

Mater. Trans.

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In recent years, ball grid array (BGA) package has been widely used in the portable electronic device, which can offer miniaturization and increased functional density. Thus, the failure chances of package under shock and vibration environments have been increased. In this work, we investigate the effect of underfill properties on bonding characteristics of underfilled BGA packaging. Three kinds of underfill materials with different additive content were formulated. Dynamic mechanical analysis (DMA), tensile test and shear test were conducted to examine the material properties of underfill resin such as the storage modulus (EA), glass transition temperature (T g ), mechanical and adhesion strength. In addition, the three-point bending test was conducted for underfilled BGA assemblies to investigate the mechanical reliability of BGA interconnects. The results indicate that the underfill resin should have a proper T g to ensure the mechanical properties, and modulus of toughness of underfill resin acts as an important factor rather than mechanical strength and EA (Stiffness) to ensure the mechanical reliability of BGA assembly.

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Coffin-Manson fatigue model of underfilled flip-chips

Cited by 73 publications

References 16 publications

Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs

Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs

Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics

Bonding Characteristics of Underfilled Ball Grid Array Packaging

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