“…CSP bridges the gap between processing temperatures of an important number of ceramics and polymers, offering a unique opportunity for the discovery, design, and fabrication of new composites with engineered grain boundaries. As an example, Randall et al investigated the potential of the CSP to several new ceramic‐polymer composites, including the Li‐ion battery electrolyte Li 1.5 Al 0.5 Ge 1.5 (PO 4 ) 3 ‐(‐CH 2 CF 2 ‐) x [‐CF 2 CF(CF 3 )‐] y , Li 1.5 Al 0.5 Ge 1.5 (PO 4 ) 3 (LAGP) or Li 1+ x + y Al x Ti 2− x Si y P 3‐ y O 12 (LATP) with bis(trifluoromethanesulfonyl)imide (LiTFSI) salts showing similar room temperature conductivity (10 −4 S·cm −1 ) as conventionally sintered ceramics, Li‐ion cathode LiFePO 4 ‐Polyvinylidene fluoride with enhanced electrochemical performances, semiconductor V 2 O 5 ‐poly(3,4‐ethylenedioxythiophene) polystyrene sulfonate composites with engineered mechanical, thermal, and electronic properties . These studies highlight the new opportunities for high ceramic volume fraction (v/v >95%) ceramic‐thermoplastic polymer composites enabled by cold sintering.…”