2014
DOI: 10.1016/j.sab.2014.06.019
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Combined evaluation of grazing incidence X-ray fluorescence and X-ray reflectivity data for improved profiling of ultra-shallow depth distributions

Abstract: The continuous downscaling of the process size for semiconductor devices pushes the junction depths and consequentially the implantation depths to the top few nanometers of the Si substrate. This motivates the need for sensitive methods capable of analyzing dopant distribution, total dose and possible impurities. X-ray techniques utilizing the external reflection of X-rays are very surface sensitive, hence providing a non-destructive tool for process analysis and control.X-ray reflectometry (XRR) is an establi… Show more

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Cited by 35 publications
(21 citation statements)
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“…The tunability of the probed depth region with the grazing angle in combination with the linearity in the intensity response of X-ray detectors was already applied to depth-proling measurements of ion-implanted samples (Al, As and B dopants in Si wafers were considered) by means of GEXRF and GIXRF. [46][47][48][49][50][51] It has to be pointed out that for the reported dopant-wafer combinations, the measurements could be performed either with excitation energies below the Si K-edge (1839 eV), thus avoiding a signicant background contribution from the wafer material or at energies above the As K-edge (11867 eV). In the latter situation the Si absorption cross-section is small and the As XRF signal can be well separated from the Si Ka line.…”
Section: Introductionmentioning
confidence: 99%
“…The tunability of the probed depth region with the grazing angle in combination with the linearity in the intensity response of X-ray detectors was already applied to depth-proling measurements of ion-implanted samples (Al, As and B dopants in Si wafers were considered) by means of GEXRF and GIXRF. [46][47][48][49][50][51] It has to be pointed out that for the reported dopant-wafer combinations, the measurements could be performed either with excitation energies below the Si K-edge (1839 eV), thus avoiding a signicant background contribution from the wafer material or at energies above the As K-edge (11867 eV). In the latter situation the Si absorption cross-section is small and the As XRF signal can be well separated from the Si Ka line.…”
Section: Introductionmentioning
confidence: 99%
“…First of all, we performed a preliminary analysis based only on the XRR data using the Leptos® software. Then, we performed a second analysis with the JGIXA software including the fluorescence spectra to derive the aluminum K α full‐energy peak area with respect to the incident angle. The results of both analyses are shown in Table .…”
Section: Examples Of Gixrf and Xrr As Complementary Techniquesmentioning
confidence: 99%
“…Nowak et al 77 performed GI-XRF and GE-XRF experiments to characterise periodic structures on silicon and silica surfaces. Ingerle et al 79 combined the evaluation of GI-XRF and XRR data for improved proling of ultra-shallow depth distributions. A novel theoretical approach based on simple geometrical optics considerations was used to explain the latter.…”
Section: Txrf and Related Techniquesmentioning
confidence: 99%