Combined Use of Laser Irradiation and Electroplating

Roos, Jozef; Célis, Jean-Pierre; Vooren, W. Van

doi:10.1007/978-94-009-4468-8_52

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Cited by 4 publications

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“…Electrodeposited gold layers are used on electrical connectors to ensure low-resistive connections and corrosion resistance [10]. In microelectronics it is applied to bonding pads for the same reasons.…”

Section: Goldmentioning

confidence: 99%

Electrodeposition for the synthesis of microsystems

Ruythooren

Attenborough

Beerten

et al. 2000

J. Micromech. Microeng.

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Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.

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Section: Goldmentioning

confidence: 99%