“…On patterned substrates, therefore, the oxide is normally removed by exposure to a hydrogen atom flux, which allows the oxide to be removed at lower temperatures, $400 1C, without surface pitting occurring, due to the reaction Ga 2 O 3 +4H-Ga 2 O+2H 2 O [10]. However, this method is known to lead to Fermi-level surface pinning and possible degradation of the surface if the hydrogen dose is not carefully controlled [11,12], and care must be taken to avoid surface contamination being introduced during the hydrogenation [13].…”