Comparative Study of the Photoelectric and Thermal Performance Between Traditional and Chip-Scale Packaged White LED

Chen, Cong; Zhao, Dezhi; Xiong, Zhihua; Niu, Yunfei; Sun, Zhen; Xiao, Weimin

doi:10.1109/ted.2021.3058091

Cited by 12 publications

(5 citation statements)

References 29 publications

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“…In contrast, excellent light output efficiency is conducive to reducing the temperature of the device and lengthening its lifetime [17]. Based on theory, experiment and simulation, the performance of PCT‐LED and EMC‐LED devices are studied [18]. The study methods include comparing photoelectric parameters under different temperatures and driving currents such as optical power and luminous flux, analysing the thermal resistance structure and junction temperature under different experimental conditions, and verifying the junction temperature obtained from theoretical calculation and simulation.…”

Section: Methodsmentioning

confidence: 99%

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Zhao

Xiong

Chen

et al. 2021

IET Optoelectronics

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With the emergence of the different light-emitting diode (LED) packaging materials, the thermal analysis of LED device packaging with different materials has become urgent. The thermal performance of LED packaging with a poly(1,4-cyclohexylenedimethylene terephthalate) frame (PCT-LED) and LED packaging with an epoxy moulding compound frame (EMC-LED) were measured and simulated. The results show that compared with EMC-LED, PCT-LED has better optical and thermal performance. The luminous efficiency of PCT-LED and EMC-LED is 177.31 and 167.42 lm/W, respectively, under 150 mA at 25°C. PCT-LED devices have a lower thermal resistance of 15.64°C/W compared with that of EMC-LED, and under the different temperature and drive current conditions, the excellent thermal characteristic of PCT-LED devices is significant. Moreover, all simulation results agree well with the experimental results, and the maximum temperature of PCT-LED falls faster than that of EMC-LED with a fluid flow rate by thermal simulation. However, EMC-LED has better antiageing performance. These results are important to guide the application of PCT-LEDs and EMC-LEDs.This is an open access article under the terms of the Creative Commons Attribution-NonCommercial-NoDerivs License, which permits use and distribution in any medium, provided the original work is properly cited, the use is non-commercial and no modifications or adaptations are made.

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Section: Methodsmentioning

confidence: 99%

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Zhao

Xiong

Chen

et al. 2021

IET Optoelectronics

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“…(2) The higher temperature of the GaN chip and phosphors due to the higher current, will further result in variations in spectral structure. For the GaN chip, rising temperature can cause not only a decrease in optical power of the initial blue spectrum, but also a red shift of the peak wavelength that finally leads to a lower match with the excitation spectrum of YAG:Ce 3+ phosphors [32]. For YAG:Ce 3+ phosphors in the coating layer, the energy difference between the ground state 4 f and excited state 5d generally reduces with rising temperature, which will contribute to degradation in conversion efficiency [33].…”

Section: Photo-electro-thermal Properties Of Cafmentioning

confidence: 99%

Measurement model of circadian action factor of phosphor-converted white LEDs based on photometric, electrical, and thermal properties

Shen,

Chen,

et al. 2024

Metrologia

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Light stimulus is confirmed to have critical non-visual biological effects on human beings, and thus evaluation of lighting quality should not be limited to traditional visual performance. The circadian action factor (CAF) has been put forward to quantify such non-visual effects of light sources. This paper focuses on studying the photometric, electrical, and thermal properties of widely used phosphor-converted white LEDs (PC-WLEDs), and establishes an indirect measurement model of CAF regarding temperature, current and excitation wavelength. During modeling, the spectral power distribution (SPD) of PC-WLEDs is described as an extended Gaussian function of the double-color (blue-yellow) spectrum. In verifications, the remarkable consistency is obtained between indirect measurements and direct calculations, while the maximum relative errors do not exceed 2.6% and the mean relative errors do not exceed 0.9%. The proposed measurement model involves a series of optical tests and calibrations, which are simple for LED system designers to comply with. It offers an effective tool to quantify the PC-WLEDs’ non-visual biological effects on human beings, avoiding costly optical instruments and laborious calculations. Furthermore, it provides a potential theoretical foundation for realizing human-centric assessment, regulation and control of artificial lighting.

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“…The emergence of the board-level thermal dissipation pads and hybrid substrates brings about another issue on reliability are discussed in paper [7]. That is, the crack failure caused by thermal stress of different materials due to Coefficient of Thermal Expansion (CTE) mismatch under high temperature environment in paper [8].…”

Section: Challenges Of Board-level Thermal Dissipation and Reliabilit...mentioning

confidence: 99%

Research on board-level thermal dissipation of the mini LED in COB packaging

Wang

2023

International Conference on Optoelectronic Information and Functional Materials (OIFM 2023)

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In view of the high Thermal Flux Density encountered with the Mini LED in COB (Chip on Board) packaging, board-level thermal dissipation is becoming more and more important. This paper analyses characteristics and trends of board-level thermal dissipation of the Mini LED. First, board-level materials are developing from the ordinary PCB (Printed Circuit Board) to metallic materials and ceramic materials. Second, the limitation of process technologies and material costs make thermal dissipation of hybrid substrates the future direction for development. In order to meet the requirements of thermal dissipation for different power devices and products, optimization design and simulation analysis of the thermal dissipation structure becomes a real necessity. Therefore, digitalized thermal simulation design and accurate thermal simulation design become a practical necessity. Finally, the reliability and the interface crack of a large number of micro pores caused by Mini LED board-level thermal dissipation are analyzed. To ensure the massive production of the Mini LED, the process level and the quality control of the entire manufacturing process must be improved.

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Comparative Study of the Photoelectric and Thermal Performance Between Traditional and Chip-Scale Packaged White LED

Cited by 12 publications

References 29 publications

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Measurement model of circadian action factor of phosphor-converted white LEDs based on photometric, electrical, and thermal properties

Research on board-level thermal dissipation of the mini LED in COB packaging

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