Comparative Study on Power Module Architectures for Modularity and Scalability

Abstract

Silicon carbide wide bandgap power electronics have gained application spaces in hybrid electric vehicle and electrical vehicles. The Department of Energy has set target performance goals for 2025 to promote electric vehicles and hybrid electric vehicles as a means of carbon emission reduction and long term sustainability. Silicon carbide technology is well suited to reach these goals. Challenges include higher expectations on power density, performance, efficiency, thermal management, compactness, cost, and reliability. This study will benchmark state of the art silicon and silicon carbide technologies. Power modules of commercial traction inverters are analyzed for their within-package interconnect scheme, module architecture, and cooling methods. A few power module package architectures from both industry adopted standards and proposed patented technologies are compared for modularity and scalability for integration into inverters. The within package interconnect schemes are crucial elements to support power module design. Current trends of power module architectures and their integration into inverter are discussed. The development of an eco-system to support the transition from silicon-based to silicon carbide-based power electronics is additionally discussed as an ongoing challenge.

The role of power device technology in the electric vehicle powertrain

“…New vertical designs for power modules 206 : Overmold 29,67,68 ; Double‐sided DBC 69‐72 ; IPM 73‐75 ; 3D integration 65,76,77 …”

“…The main power‐module innovations are focused on new designs and materials 230,231 . These can be divided into four categories (Figure 17 206 ): Overmold: this technology employs lead‐frame and thin‐film insulation substrates that directly bind the semiconductors, thus increasing the connection surface of the dies 29 . Generally, modules using this technology have lower stray inductances and the R th is considerably reduced compared to the conventional DBC structure.…”

“…T A B L E 1 Features of power modules or discrete devices with the inverter fitted in some commercial vehicles (sorted by year and semiconductor technology) 2,3,28,29 CAGR 2019-2025 (compound annual growth rate) in the sector of 4.3%.…”

“…are presented in this work. In addition, the technical limitations are described and summarized (λ and CTE), pinpointing the main technical solutions adopted by the manufacturers and the trends arising from recent experimental innovations (overmold, 29,67,68 double-sided DBC, [69][70][71][72] IPM, [73][74][75] and 3D structure 65,76,77 ). Likewise, the technical characteristics of the cooling systems are also addressed, indicating the proven technologies and the most advanced concepts to evacuate the heat from the power modules, essential to prevent overheating and device destruction.…”

“…Overmold: this technology employs lead-frame and thin-film insulation substrates that directly bind the semiconductors, thus increasing the connection surface of the dies. 29 Generally, modules using this technology have lower stray inductances and the R th is considerably reduced compared to the conventional DBC structure. The latter structure ensures that the temperature will be more evenly distributed over the surfaces.…”