Comparative study on solder joint reliability using different FE-models

Wang, Zhu; Stoeckl, S.; Pape, H.; Gan, Swee Lee

doi:10.1109/eptc.2003.1271607

Cited by 9 publications

(6 citation statements)

References 8 publications

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“…Tee et al investigated design parameters, including die size, substrate size and solder joint size, for the SJR of the Low Profile Fine-Pitch BGA (LFBGA) by the finite element method, and found that the smaller die size can cause less CTE mismatch between chips and solders and prolongs the solder fatigue life [4]. Zhu et al applied the ANSYS software to study the difference of fatigue life prediction between a 3D-Slice model and 1/8-symmetric model, and then the results showed that the fatigue life predicted by using the 3D-Slice model can reduce computation time and storage space within an acceptable error range [5].…”

Section: Introductionmentioning

confidence: 99%

Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint

Mao

Chen

2008

Microelectronics Reliability

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Section: Introductionmentioning

confidence: 99%

Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint

Mao

Chen

2008

Microelectronics Reliability

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“…Due to different melting temperatures and wettability, Pb-free solder joints are more prone to voids. The effect of voids on durability and stress concentration in solder joints have been studied by researchers such as Lau et al [2], [1], Liu and Mei [3], Banks et al [4], Yunus et al [5], Doroszuk et al [6], Zhu et al [7], Kim et al [8], and Herzog et al [9]. Some of these researchers have come up with conflicting results about the effect of voids on durability or stress distribution in solder balls.…”

Section: Interaction Effect Of Voids and Standoff Height On Thermomecmentioning

confidence: 99%

Interaction Effect of Voids and Standoff Height on Thermomechanical Durability of BGA Solder Joints

Ladani

Razmi

2009

IEEE Trans. Device Mater. Relib.

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This paper documents simulation studies on the interactive effect of standoff height and void volume on the thermomechanical durability of ball-grid-array solder joints using a 3-D viscoplastic finite element analysis. Surface Evolver software was used to find the optimized shape of the solder joints and standoff height by minimizing the surface energy as voids with different sizes were placed in solder balls. A global-local modeling approach was then utilized to model the thermomechanical durability of voided solder joints. Void-area-fraction ranges of 14%-40% were analyzed. A nonmonotonic behavior of durability versus void area fraction was observed. The results showed that, if the void is completely inside the solder ball and has no interface with the boundaries of the joint, it does not have a detrimental effect and even improves the durability as the void size increases. However, voids located at the interface of the solder joint and copper pads were found very detrimental to durability. Factors such as load bearing area, stress concentration factor, and overall compliance of the structure were found responsible for the nonmonotonic behavior of the joints. An analytical micromechanics approach was used to calculate the compliance of the structure, and a nonmonotonic trend in phase with the durability trend was observed. The stress concentration factor also showed the same nonmonotonic trend. The rise of these two factors for the void interfacing with copper pads in addition to the decreased-load-bearing-area effect resulted in a drastic decrease in durability.

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“…Because of low-cycle fatigue, the plastic strain is a key factor in reliability. In 2003, Zhu [3] discussed the effect of different analytic configurations of the finite element on its fatigue life prediction due to parametric changes of the package using a three-dimensional slice model and 1/8 symmetric model. However, the 3D-slice model can save much more time and storage under simulation analysis.…”

Section: Introductionmentioning

confidence: 99%

Application of Optimal Design on Twin Die Stacked Package by Reliability Indicator of Average SED Concept

2012

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This paper deals with the optimal design for a twin die stacked package. Firstly, the numerical model is built up in terms of a three-dimensional slice model along the diagonal direction of the package. The material behavior of the solder balls is a consequence of the viscoplastic property which can be described by the Anand's model. Secondly, the Darveaux model is applied to predict the solder ball reliability of the stacked die package under a cyclic temperature loading. Since simulation analysis found an obvious relation is found between the fatigue life of the solder ball and the distribution of the accumulated strain energy density (SED) on the critical solder ball of the package through the simulation analysis, the average value of the strain energy density for all solder balls is adopted as the optimization indicator of reliability. With such a viewpoint, the critical solder ball position can be ignored, and accordingly an efficient analysis can be obtained. Finally, the Box-Behnken regression model is adopted to construct all the experiments. Each experiment analyzes the reliability of the package under varying parameters. Subsequently, the pattern search algorithm is applied to search for optimal factors.Through optimal analysis with the fatigue reliability indicator of an average SED, the fatigue life is found to be 59 lower than that of the original design. The fatigue life had clearly improved and the lowest ball fatigue life is found to be 2.859 times longer than the original one.

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Comparative study on solder joint reliability using different FE-models

Cited by 9 publications

References 8 publications

Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint

Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint

Interaction Effect of Voids and Standoff Height on Thermomechanical Durability of BGA Solder Joints

Application of Optimal Design on Twin Die Stacked Package by Reliability Indicator of Average SED Concept

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