Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking

Wang, Jianhao; Xue, Songbai; Wang, Jianxin; Zhang, Peng; Yu, Tao; Wang, Ziyi

doi:10.1007/s10854-020-03141-z

Cited by 16 publications

(5 citation statements)

References 36 publications

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“…The corresponding element mapping result in Figure 8(b) showed that the chemical compositions of the fracture surface were mainly Sn and Pb, while the existence of Cu was hardly detected. Thus, the fracture of as-soldered joint occurred and prolongated in the solder matrix, which exhibited a typical ductile fracture mode [25, 26]. After 200 cycles, the majority of fracture surfaces were still shear dimples of solder matrix, which was similar to the as-soldered joint.…”

Section: Resultsmentioning

confidence: 99%

Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

Wang

Xue

Liu

et al. 2022

Science and Technology of Welding and Joining

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To meet the demand of cryogenic reliability on the electronic packaging for deep space satellite, the three-dimensional interfacial morphology and property of eutectic SnPb solder joint under an extreme thermal shocking of 77-423 K were investigated. After thermal shocking, Cu-Sn IMC layers coarsened in the cross-sectional observation and micro-cracks formed in Cu 6 Sn 5 layer. The rough Cu 6 Sn 5 layer in the top view gradually smoothed, with broken Cu 6 Sn 5 particles and exposed Cu 3 Sn. In the bottom-view observation, the Cu 6 Sn 5 layer of as-soldered joint was overlapped by Cu 3 Sn layer. But no defects were generated in Cu 3 Sn layer. The shear force of solder joint was greatly reduced due to broken Cu 6 Sn 5 with the changing fracture characteristics from the solder-controlled mode to the solder/IMC mixed mode.

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Section: Resultsmentioning

confidence: 99%

Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

Wang

Xue

Liu

et al. 2022

Science and Technology of Welding and Joining

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“…e formation of IMC layer is the foundation of reliable bonding between solder matrix and substrate, but the morphology of IMC layer significantly affects the property of solder joint [38]. During the service condition, the coefficient of thermal expansion (CTE) mismatch of solder matrix and substrate put much thermal stress at the interface, where the existence of thick brittle IMC layer provides the crack source and increases the fracture risk of solder joint [39]. Recently, some researchers tried to suppress the precipitation of Au 5 Sn and precipitate relatively ductile phases by doping Ag or Cu.…”

Section: Mechanical Propertymentioning

confidence: 99%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.

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“…However, the decrease in size of the solder joint puts higher requirements on the wettability of the solder alloy because the solder must be able to spread well on smaller pads to form separated joints with no bridging, avoiding the short failures of integrated circuits. Therefore, the SnPb solder with excellent wettability can better meet the requirements of small-sized solder joints compared with the Pb-free solders, and it has broad application prospects in the packaging of advanced electronic systems in the aerospace and national defense industries [4]. Moreover, due to the significant improvements in the integration and power of electronic devices, heat dissipation is increasingly difficult, which leads to the service temperature of the solder joints increasing [5].…”

Section: Introductionmentioning

confidence: 99%

“…A recent study [7] reveals that adding a small amount of Sb can significantly improve the reliability of a solder, and a significant improvement effect can be achieved with 1.0 wt % of Sb addition, while an excessive Sb addition will embrittle the solder. For the SnPbSb solder, investigations reveal that thermal cycling of −65~150 • C not only increases the thickness of the intermetallic compound (IMC) layer at the joint interface, but also decreases the strength of the SnPbSb/Cu solder joint, while the thermal shock at −196~150 • C will result in microcracks at the SnPbSb/Cu joint interface and deteriorate the performance of the solder joints [4,8]. Therefore, it can be considered that the SnPbSb/Cu solder joint is sensitive to its service environment, and it is necessary to clarify the influences of service environments on the microstructure and properties of the SnPbSb/Cu solder joints to ensure the reliable application of the SnPbSb solder.…”

Section: Introductionmentioning

confidence: 99%

Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application

Zhou

et al. 2022

Crystals

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With the continuous miniaturization and increase in functionality of the electronic devices used in the aerospace and national defense industries, the requirements for reliability of the solder joints in these devices keep increasing. In this study, a SnPbSb solder with excellent wettability was used as the research object, and the effects of high-temperature aging at 150 °C on the microstructure and mechanical properties of SnPbSb/Cu solder joints were investigated according to the relevant industry standards. It was found that high-temperature aging does not change the eutectic structure of the SnPbSb solder, but it does significantly coarsen the Sn-rich phase and the Pb-rich phase in the solder. In addition, the interfacial intermetallic compound (IMC) layer in the SnPbSb/Cu solder joint changes from a Cu6Sn5 single layer to a Cu6Sn5/Cu3Sn double layer after the aging, and the thickness of the IMC layer increases greatly. High-temperature aging significantly deteriorates the mechanical properties of the solder joints. After aging at 150 °C for 1000 h, the shear strength of the SnPbSb/Cu solder joints decreased by 45.39%, while the ductile fracture mode did not change.

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Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking

Cited by 16 publications

References 36 publications

Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application

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