Comparison between two processes using oxygen in the Cu/AlN bonding

Jarrige, Jean; Joyeux, Thierry; Lecompte, Jean-Pierre; Labbé, Jean‐Claude

doi:10.1016/j.jeurceramsoc.2006.04.037

Cited by 16 publications

(4 citation statements)

References 10 publications

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“…133, has determined the thermal properties across the interface of AlN-Cu DCBs, with the conclusion that good thermal bonds can be made if the partial pressure of oxygen and the time and temperature for joining are all carefully controlled. 134,135 Sputtering 136,137 and ion implantation 138,139 have been used to replace the oxidation step by implanting Ti and Fe into the interface. Shear strengths of 70 MPa can be achieved by this method with Ti and are five times the values for conventional DCBs.…”

Section: Gas-metal Eutectic Bonding (Dcb)mentioning

confidence: 99%

Joining of engineering ceramics

Fernie

Drew

Knowles

2009

International Materials Reviews

250

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Engineering ceramics such as alumina, zirconia, silicon nitride and silicon carbide can now be manufactured reliably with reproducible properties. As such, they are of increasing interest to industry, particularly for use in demanding environments, where their thermomechanical performance is of critical importance, with applications ranging from fuel cells to cutting tools. One aspect common to virtually all applications of engineering ceramics is that eventually they must be joined with another material, most usually a metal. The joining of engineering ceramics to metals is not always easy. There are two main considerations. The first consideration is the basic difference in atomic bonding: the ionic or covalent bonding of the ceramic, compared to the metallic bond. The second consideration is the mismatch in the coefficient of thermal expansion. In general, ceramics have a lower coefficient of thermal expansion than metals and, if high tensile forces are produced in the ceramic, either as a consequence of operating conditions or from the joining procedure itself, failure can occur. The plethora of joining processes available will be reviewed in this article, placing them in context from both an academic and commercial perspective. Comment will be made on research reporting advances on known technology, as well as introducing 'newer' technologies developed over the last 10 years. Finally, reviews and commentary will be made on the potential applications of the various joining processes in the commercial environment.

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Section: Gas-metal Eutectic Bonding (Dcb)mentioning

confidence: 99%

Joining of engineering ceramics

Fernie

Drew

Knowles

2009

International Materials Reviews

250

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“…The method of DBC relies on the Cu-Cu 2 O eutectic liquid between copper and the oxide of Cu 2 O on the surface of the ceramic, whereby ceramic/metal joining can successfully occur [14]. Nevertheless, the Cu-Cu 2 O eutectic liquid is hardly formed between AlN ceramic and copper, ascribed to the insu cient amount of oxide on the surface of AlN ceramic [15]. Thus, in order to join AlN to copper by DBC method, oxygen must be provided on the surface of AlN ceramics to produce a thin layer of Al 2 O 3 , needed to join the two aforementioned materials [16].…”

Section: Introductionmentioning

confidence: 99%

Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil

Huang

Chen

et al. 2021

J Mater Sci: Mater Electron

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The reliability of wide-bandgap (WBG) semiconductors used as power electronics is closely related to the high thermal conductivity of AlN-metalized substrates. Thus, the bonding of AlN ceramics with metals is a key issue for the production of reliable AlN-metalized substrates. This paper reports on a new method for producing AlN/Cu joints by employing a novel lm-metallization production process, which involves a porous network of Cu layer and Ag foil. The microstructure and the phases formed at the interface of the AlN/Cu joints produced at various brazing temperatures and times, were analyzed by scanning electron microscopy and X-ray diffraction analysis. Strong joints with shear strength of 48.5 MPa were produced after brazing at 850 °C for 10 min. The typical microstructure at the interfacial reaction zone was Cu / Ag(s) + Cu(s) / CuAlO 2 + Al 2 O 3 + Cu(s) / AlN. The experimental results manifest the crucial role of the Ag-Cu eutectic liquid phase, formed by the reaction between the Cu layer and the Ag foil, and of the porous network of the Cu layer deposited on the surface of the AlN ceramic substrate, since both of them effectively favor the reduction of the residual thermal stresses in the joint and result in strong ceramic/metal joins.

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“…etapa adicional, que envolve a pré-oxidação da superfície do substrato de AlN, com formação de uma camada de Al 2 O 3 [5,11]. Neste caso, a adesão metal-cerâmica ocorre devido à formação do CuAl 2 O 4 , similar ao observado no processo DBC para o Al 2 O 3 [5].…”

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Processamento, propriedades e aplicações das cerâmicas de nitreto de alumínio

Molisani

2017

Cerâmica

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INTRODUÇÃOA tecnologia planar em silício possibilitou a fabricação de dispositivos eletrônicos miniaturizados (circuitos integrados ou chips). Este processo avançou até atingir dimensões que resultaram em problemas tanto de flexibilização funcional como de custos efetivos, que inviabilizaram a produção de chips com alta complexidade. Os referidos problemas foram solucionados com o advento da tecnologia de circuitos passivos, que é responsável pela fabricação de substratos e componentes para encapsulamento (packaging), os quais são acoplados ao chip de silício para fornecer interconexão,

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Comparison between two processes using oxygen in the Cu/AlN bonding

Cited by 16 publications

References 10 publications

Joining of engineering ceramics

Joining of engineering ceramics

Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil

Processamento, propriedades e aplicações das cerâmicas de nitreto de alumínio

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