Comparison of advanced PoP package configurations

A PoP structure to support I/O over 2000

“…The key features of those smart devices are providing thinner profile [2], faster data transfer rate and lower power consumption at high bandwidth [3]. In stacked memory application, 3.2~6.4 GB/s bandwidth of LPDDR2 DRAM can't provide faster access to the Internet and fluid viewing of high resolution video.…”

A novel stacking method of filling hole used in package on package

“…Currently, most of the package on package (POP) stack adopted the bump interconnection with the solder balls as shown in Figure 1. Die embedded in the substrate which bonded to the underlying pad with golden wires; upper and lower substrates are interconnected by solder ball, after reflow soldering, the whole POP as a SOC was soldered to the printed circuit board [2,3,6]. However, traditional POP which adopted the bump interconnection with the solder balls may result in some issues, such as shifting, the bridging of adjacent solder balls, and the warpage of the substrate due to the different thermal stress which seriously influenced the practical application [4,5,7].…”