2011
DOI: 10.1016/j.microrel.2011.01.004
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Comparison of low-temperature electrical characteristics of gate-all-around nanowire FETs, Fin FETs and fully-depleted SOI FETs

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Cited by 5 publications
(6 citation statements)
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“…The nanosheet preparations are still based on the anisotropic etching of the Si x Ge y superlattice. The etching rate can be controlled by varying the composition and with different etching techniques [ 19 , 20 , 21 , 26 , 27 , 28 ]. Worth mentioning achievement is the seven-level nanosheet structure reported on a 150-nm-thick Si 0.7 Ge 0.3 /Si multilayers [ 28 ].…”
Section: Discussionmentioning
confidence: 99%
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“…The nanosheet preparations are still based on the anisotropic etching of the Si x Ge y superlattice. The etching rate can be controlled by varying the composition and with different etching techniques [ 19 , 20 , 21 , 26 , 27 , 28 ]. Worth mentioning achievement is the seven-level nanosheet structure reported on a 150-nm-thick Si 0.7 Ge 0.3 /Si multilayers [ 28 ].…”
Section: Discussionmentioning
confidence: 99%
“…However, mobility optimization can also be achieved according to the channel structure if the channel length cannot be shortened. In the 3D FinFET and VNSFET, considering the mobility values are different in different crystal orientations and are size dependent, there are technical values to compare the effective mobility of FinFET and VNSFET [ 17 , 19 , 20 , 21 , 25 ].…”
Section: The Effect Of Channel Mobility On Scalingmentioning
confidence: 99%
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