2017
DOI: 10.1016/j.jmatprotec.2017.03.023
|View full text |Cite
|
Sign up to set email alerts
|

Compound forming of 7075 aluminum alloy based on functional integration of plastic deformation and thixoformation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
9
0

Year Published

2018
2018
2022
2022

Publication Types

Select...
9

Relationship

0
9

Authors

Journals

citations
Cited by 27 publications
(9 citation statements)
references
References 17 publications
0
9
0
Order By: Relevance
“…2c) It is important to be noted that, thixoforming process results in the AlCu microstructure on the globular shape and fine, which is very essential for increasing the mechanical properties [12]. Such structures could be obtained by thixoforming process with appropriate parameters of pressure and temperature [13,14].…”
Section: Resultsmentioning
confidence: 99%
“…2c) It is important to be noted that, thixoforming process results in the AlCu microstructure on the globular shape and fine, which is very essential for increasing the mechanical properties [12]. Such structures could be obtained by thixoforming process with appropriate parameters of pressure and temperature [13,14].…”
Section: Resultsmentioning
confidence: 99%
“…Using the same method, data (including the volume fraction, the grain size, and ln Z after dynamic recrystallization) involving different conditions could be obtained (Table 2). By substituting the data in Table 2 into Equations (11) and (12), the dynamic model for dynamic recrystallization of the 6082 Al alloy is expressed as follows:…”
Section: Modeling Of Dynamic Recrystallizationmentioning
confidence: 99%
“…As one important means for the structural refinement of materials, dynamic recrystallization is used in the optimization of technological parameters for material formation and prediction and control over the microstructure. It is thought that metals (e.g., Al and Al alloys) with a high stacking fault energy are mainly subjected to dynamic recovery while barely undergoing dynamic recrystallization during thermoplastic deformation [10,11]. Additionally, it is also hard to observe fine subgrain structures in these metals through metallography; however, with the development of electron microscopy, the low-angle grain boundary (LAB) of subgrains can be observed using electron backscatter diffraction (EBSD) technology.…”
Section: Introductionmentioning
confidence: 99%
“…Al and aluminum alloys) with a high stacking fault energy were mainly subjected to dynamic recovery but little dynamic recrystallization during thermoplastic deformation. 10,11 It is difficult to observe fine subgrain structures in these metals through metallography. However, with the development of electron microscopy, the low-angle grain boundaries (LABs) of subgrains can be observed by using electron backscatter diffraction (EBSD).…”
Section: Introductionmentioning
confidence: 99%