Computational study of transverse Peltier coolers for low temperature applications

Ali, Syed Ashraf; Mazumder, Sandip

doi:10.1016/j.ijheatmasstransfer.2013.03.018

Cited by 20 publications

(2 citation statements)

References 10 publications

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“…A derivation of Equation (6) assumes a one-dimensional electrical current flow in the y direction and a heat flow in the z direction, which requires that the transverse TE element has a large length-to-thickness ratio (L/d) [17]. The maximum temperature difference, ΔTmax, is achieved when the COP approaches zero [16,35]:…”

Section: Cooling Performancementioning

confidence: 99%

“…This framework first utilized the Kirchhoff Circuit Laws (KCL) to calculate the equivalent properties in the directions parallel and perpendicular to the layer plane, and then employed a tensor transformation to obtain the properties in an arbitrary direction. The validity of this simplified mathematical model has been demonstrated by multiple studies using either finite element simulations [16,17] or experimental simplified mathematical model has been demonstrated by multiple studies using either finite element simulations [16,17] or experimental measurements [12,[18][19][20][21][22][23][24][25][26][27]. In addition to the lamella configuration, composite materials with aligned one-dimensional (1-D) inclusions, as suggested by Goldsmid [1,4], are also good candidates for transverse TE.…”

Section: Introductionmentioning

confidence: 96%

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Transverse Thermoelectricity in Fibrous Composite Materials

Qian

Ren

2017

Energies

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Transverse thermoelectric elements have the potential to decouple the electric current and the heat flow, which could lead to new designs of thermoelectric devices. While many theoretical and experimental studies of transverse thermoelectricity have focused on layered structures, this work examines composite materials with aligned fibrous inclusions. A simplified mathematical model was derived based on the Kirchhoff Circuit Laws (KCL), which were used to calculate the equivalent transport properties of the composite structures. These equivalent properties, including Seebeck coefficient, electrical conductivity, and thermal conductivity, compared well with finite element analysis (FEA) results. Peltier cooling performance was also examined using FEA, which exhibited good agreement to KCL model predictions. In addition, a survey was conducted on selected combinations of thermoelectric materials and metals to rank their transverse thermoelectricity with respect to the dimensionless figure of merit.

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Section: Cooling Performancementioning

confidence: 99%

Section: Introductionmentioning

confidence: 96%

Transverse Thermoelectricity in Fibrous Composite Materials

Qian

Ren

2017

Energies

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Continuum Theory of TE Elements

Zabrocki

Goupil

Ouerdane

et al. 2015

Continuum Theory andModeling of Thermoelectric Elements

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Thermoelectric Devices: A Review of Devices, Architectures, and Contact Optimization

Schierning

Nielsch

2017

Adv Materials Technologies

322

247

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In recent years, the substantially improved performance of thermoelectric (TE) materials has attracted considerable interest in studying the potential applications of the TE technique. Serving as the bridge between TE materials and applicable TE products, TE devices must be properly designed, engineered, and assembled to meet the required performance of TE products for cooling (thermoelectric cooler) and power generation (thermoelectric generator). The principle feasibility of the TE technique has been demonstrated using a variety of different materials and processing technologies, and many different architectures of TE devices have been successfully realized. This review discusses the architectures of TE devices, including bulk and thin‐film TE devices, TE devices with flexible designs, pn‐junction‐based TE devices that provide robust solutions for high operation temperatures, and the meta‐material‐based transverse TE devices. In addition, the assembly of TE devices involves contact layers on which the reliability of TE devices depends. Thus solutions to contact issues, including bonding strength, contact resistance, and thermomechanical stress, are also reviewed.

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Computational study of transverse Peltier coolers for low temperature applications

Cited by 20 publications

References 10 publications

Transverse Thermoelectricity in Fibrous Composite Materials

Transverse Thermoelectricity in Fibrous Composite Materials

Continuum Theory of TE Elements

Thermoelectric Devices: A Review of Devices, Architectures, and Contact Optimization

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