“…Active devices, instead, require TCAD simulations, e.g., through the drift-diffusion model or higher-order non-stationary transport models, solved over a domain scale of a few hundredths of nanometers, with a discretization grid fine enough to include all relevant device features like doping distribution, material layers, and contact properties. Physics-based simulation may resort to general-purpose physical simulators, like Comsol Multiphysics, to more specific device TCAD commercial simulators, like Synopsys Sentaurus [27] or Silvaco Victory Device [28], or, finally, to ad hoc developed codes, like our TCAD simulator [29], which has been used for this work. MMIC thermal analysis is not included in this work, as it features manifold aspects (e.g., the coupling between the TCAD thermal model and circuit-level analysis through self-consistent electro-thermal solutions [30], or the integration with FEM-3D thermal analysis tools like Keysigth PathWave [31] or Cap-Sym SYMMIC [32]), which would fall outside the scope of this paper, but is the object of future developments, as it is gaining an increasingly important role in a wide range of applications.…”