Construction of 1D Heterostructure NiCo@C/ZnO Nanorod with Enhanced Microwave Absorption

Wang, Jianwei; Jia, Zirui; Liu, Xuehua; Dou, Jinlei; Xu, Binghui; Wang, Bingbing; Wu, Guanglei

doi:10.1007/s40820-021-00704-5

Cited by 317 publications

(88 citation statements)

References 73 publications

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“…Compared with the Ag NW counterparts, both SE T and SE R of the rGO/Ag NW films are higher because of the enhanced conductivity. The Ag NW conductive network is conducive to induced current transmission upon alternating electric field, enabling an electromagnetic-thermal energy conversion [ 44 ]. With the increase in Ag NW, the value of SE A shows an upward trend due to the gradually improved conductive network.…”

Section: Resultsmentioning

confidence: 99%

Multifunctional Integrated Transparent Film for Efficient Electromagnetic Protection

et al. 2022

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Silver nanowire (Ag NW) has been considered as the promising building block for the fabrication of transparent electromagnetic interference (EMI) shielding films. However, the practical application of Ag NW-based EMI shielding films has been restricted due to the unsatisfactory stability of Ag NW. Herein, we proposed a reduced graphene oxide (rGO) decorated Ag NW film, which realizes a seamless integration of optical transparency, highly efficient EMI shielding, reliable durability and stability. The Ag NW constructs a highly transparent and conductive network, and the rGO provides additional conductive path, showing a superior EMI shielding effectiveness (SE) of 33.62 dB at transmittance of 81.9%. In addition, the top rGO layer enables the hybrid film with reliable durability and chemical stability, which can maintain 96% and 90% EMI SE after 1000 times bending cycles at radius of 2 mm and exposure in air for 80 days. Furthermore, the rGO/Ag NW films also possess fast thermal response and heating stability, making them highly applicable in wearable devices. The synergy of Ag NW and rGO grants the hybrid EMI shielding film multiple desired functions and meanwhile overcomes the shortcomings of Ag NW. This work provides a reference for preparing multifunctional integrated transparent EMI shielding film.

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Section: Resultsmentioning

confidence: 99%

Multifunctional Integrated Transparent Film for Efficient Electromagnetic Protection

et al. 2022

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“…3 g, h), the intensity of reflected EMW in the Z axis direction is evidently diminished and the angle between the maximum radiation direction and the Z axis visibly increases when the filling medium of C-wood channels is changed from air to CIP/resin. According to electromagnetic transmission theory [ 10 , 12 , 48 – 52 ], radiation direction of EMW is closely related to transmission phase of EMW and EM properties of media. Figure S9 and S10 shows that the difference in EM parameters between CIP/resin and C-wood is much greater than the difference in EM parameters between air and C-wood in the frequency range of 8.2–18.0 GHz.…”

Section: Resultsmentioning

confidence: 99%

“…Thus, based on current high-temperature microwave absorbing materials, the development of a novel high-temperature EM protection material integrating above two EM protection mechanisms facilitates the simultaneous optimization of effective bandwidth and thickness. In accordance with electromagnetic transmission theory [ 10 , 12 ], deflection of reflected wave is a result of superposition for multiple electromagnetic wave (EMW) with different phases. Obviously, general microwave absorbing materials obtained by uniformly dispersing absorbents in matrices have translational invariance of EM properties in the horizontal direction, failing to obtain EMW with different phases.…”

Section: Introductionmentioning

confidence: 99%

Bio-Inspired Microwave Modulator for High-Temperature Electromagnetic Protection, Infrared Stealth and Operating Temperature Monitoring

Yang

Duan

Liu³

et al. 2021

Nano-Micro Lett.

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High-temperature electromagnetic (EM) protection materials integrated of multiple EM protection mechanisms and functions are regarded as desirable candidates for solving EM interference over a wide temperature range. In this work, a novel microwave modulator is fabricated by introducing carbonyl iron particles (CIP)/resin into channels of carbonized wood (C-wood). Innovatively, the spaced arrangement of two microwave absorbents not only achieves a synergistic enhancement of magnetic and dielectric losses, but also breaks the translational invariance of EM characteristics in the horizontal direction to obtain multiple phase discontinuities in the frequency range of 8.2–18.0 GHz achieving modulation of reflected wave radiation direction. Accordingly, CIP/C-wood microwave modulator demonstrates the maximum effective bandwidth of 5.2 GHz and the maximum EM protection efficiency over 97% with a thickness of only 1.5 mm in the temperature range 298–673 K. Besides, CIP/C-wood microwave modulator shows stable and low thermal conductivities, as well as monotonic electrical conductivity-temperature characteristics, therefore it can also achieve thermal infrared stealth and working temperature monitoring in wide temperature ranges. This work provides an inspiration for the design of high-temperature EM protection materials with multiple EM protection mechanisms and functions.

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“…Garrett [ 3 ], of the technical department of Akrometrix, used Timoshenko’s biomaterial warpage theory [ 1 ] to derive the variables of warpage after an IC molding process: material properties (Young’s modulus and CTE), mold compound, substrate thickness, and temperature of the molding process. Wu et al [ 4 , 5 ] discussed how the material properties of epoxy composites affected the performance of electronic devices and discovered the desirable dielectric and thermal properties for their design; they also studied the microwave absorption for nanorod and spinel structures [ 6 , 7 ]. Although some studies have analyzed package warpage theoretically, they simplified the structure into only the mold compound and substrate.…”

Section: Introductionmentioning

confidence: 99%

Study on the Strip Warpage Issues Encountered in the Flip-Chip Process

Chuang

Chen

2022

Materials

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This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors between simulated and experimental values were found to be less than 8%. Taguchi analysis was employed to identify the key factors affecting strip warpage, which were discovered to be die thickness and substrate thickness, followed by mold compound thickness and molding temperature. Although a greater die thickness and mold compound thickness reduce the strip warpage, they also substantially increase the overall strip thickness. To overcome this problem, design criteria are proposed, with the neutral axis of the strip structure located on the bump. The results obtained using the criteria revealed that the strip warpage and overall strip thickness are effectively reduced. In summary, the proposed model can be used to evaluate the effect of structural design and process parameters on strip warpage and can provide strip design guidelines for reducing the amount of strip warpage and meeting the requirements for light, thin, and short chips on the production line. In addition, the proposed guidelines can accelerate the product development cycle and improve product quality with reduced development costs.

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Construction of 1D Heterostructure NiCo@C/ZnO Nanorod with Enhanced Microwave Absorption

Cited by 317 publications

References 73 publications

Multifunctional Integrated Transparent Film for Efficient Electromagnetic Protection

Multifunctional Integrated Transparent Film for Efficient Electromagnetic Protection

Bio-Inspired Microwave Modulator for High-Temperature Electromagnetic Protection, Infrared Stealth and Operating Temperature Monitoring

Study on the Strip Warpage Issues Encountered in the Flip-Chip Process

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