2021
DOI: 10.1016/j.addma.2020.101622
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Continuous three-dimensional path planning (CTPP) for complex thin parts with wire arc additive manufacturing

Abstract: HAL is a multi-disciplinary open access archive for the deposit and dissemination of scientific research documents, whether they are published or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L'archive ouverte pluridisciplinaire HAL, est destinée au dépôt et à la diffusion de documents scientifiques de niveau recherche, publiés ou non, émanant des établissements d'enseignement et de recherche français ou étrangers, des labor… Show more

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Cited by 31 publications
(12 citation statements)
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“…Additive technologies originating from fusion and solid-state welding expand the potential of AM. Wire arc additive manufacturing (WAAM) can be used to produce medium-to-large-sized thin-walled parts at lower cost [ 47 ]. WAAM adopts arc welding tools and wire as feedstock for the fabrication of structures of low to medium complexity [ 48 ].…”
Section: Additive Manufacturingmentioning
confidence: 99%
“…Additive technologies originating from fusion and solid-state welding expand the potential of AM. Wire arc additive manufacturing (WAAM) can be used to produce medium-to-large-sized thin-walled parts at lower cost [ 47 ]. WAAM adopts arc welding tools and wire as feedstock for the fabrication of structures of low to medium complexity [ 48 ].…”
Section: Additive Manufacturingmentioning
confidence: 99%
“…In recent years, the path planning problem has been intensively researched due to manufacturing and warehouses robotization [1][2][3]. Numerous mobile robots, robotic arms and human workers in a single workspace lead to logistic problems, due to safety collision-free requirements [4,5].…”
Section: Introductionmentioning
confidence: 99%
“…By laying successive layers of appropriate dimensions, it is possible to shape the final form of the product. Unfortunately, a few starts and stops of the arc passing from one layer to another cause transient phenomena that slow down the printing process, which can be eliminated by using CTPP-Continuous Three-dimensional Path Planning [14] or Robot-Centered Path-Planning [15]. Attention is also paid to the detection of defects using High Dynamic Range Images [16].…”
Section: Introductionmentioning
confidence: 99%