Cooling of mobile electronic devices using phase change materials

Tan, F.L.; Tso, C.P.

doi:10.1016/j.applthermaleng.2003.09.005

Cited by 313 publications

(78 citation statements)

References 2 publications

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“…Latent thermal storage units can be found in heat pumps, building temperature control, off-peak electricity storage, waste heat recovery systems, the cooling of electronic devices and many other fields [1,2]. Furthermore, the combination of solar power and LTS, like solar heating systems and solar cooking, is currently being researched [1].…”

Section: Introductionmentioning

confidence: 99%

Numerical Analysis of Shell-and-Tube Type Latent Thermal Energy Storage Performance with Different Arrangements of Circular Fins

2017

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Latent thermal energy storage (LTS) systems are versatile due to their high-energy storage density within a small temperature range. In shell-and-tube type storage systems fins can be used in order to achieve enhanced charging and discharging power. Typically, circular fins are evenly distributed over the length of the heat exchanger pipe. However, it is yet to be proven that this allocation is the most suitable for every kind of system and application. Consequently, within this paper, a simulation model was developed in order to examine the effect of different fin distributions on the performance of shell-and-tube type latent thermal storage units at discharge. The model was set up in MATLAB Simulink R2015b (The MathWorks, Inc., Natick, MA, USA) based on the enthalpy method and validated by a reference model designed in ANSYS Fluent 15.0 (ANSYS, Inc., Canonsburg, PA, USA). The fin density of the heat exchanger pipe was increased towards the pipe outlet. This concentration of fins was implemented linearly, exponentially or suddenly with the total number of fins remaining constant during the variation of fin allocations. Results show that there is an influence of fin allocation on storage performance. However, the average storage performance at total discharge only increased by three percent with the best allocation compared to an equidistant arrangement.

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Section: Introductionmentioning

confidence: 99%

Numerical Analysis of Shell-and-Tube Type Latent Thermal Energy Storage Performance with Different Arrangements of Circular Fins

2017

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“…For low profile scales the design of cooling solutions becomes more difficult and new ideas and approaches should be considered. Examples of technologies under development for thermal management of portable electronic devices are phase change materials Tan and Tso [3], micro heat pipes Launay, et al [4] and high conductivity materials such as carbon substrates. The focus of these technologies is upon heat spreading and transport within a device rather than active removal of heat from the device.…”

Section: Accepted Manuscriptmentioning

confidence: 99%

Active cooling of a mobile phone handset

Grimes

Walsh

2010

Applied Thermal Engineering

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Power dissipation levels in mobile phones continue to increase due to gaming, higher power applications, and increased functionality associated with the internet. The current cooling methodologies of natural convection and radiation limit the power dissipation within a mobile phone to between 1-2 W depending on size. As power dissipation levels increase, products such as mobile phones will require active cooling to ensure that the devices operate within an acceptable temperature envelop from both user comfort and reliability perspectives. In this paper, we focus on the applied thermal engineering problem of an active cooling solution within a typical mobile phone architecture by implementing a custom centrifugal fan within the mobile phone. Its performance is compared in terms of flow rates and pressure drops, allowable phone heat dissipation and maximum phone surface temperature as this is the user constraint for a variety of simulated PCB architectures in the mobile phone. Perforated plates with varying porosity through different size orifices are used to simulate these architectures. The results show that the power level dissipated by a phone for a constant surface temperature may be increased by ~50 -75% depending on pressure drop induced by the internal phone architecture. Hence for successful implementation and efficient utilization of active cooling will require chip layout to be considered at the design stage.

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“…LHS has been widely applied in building materials, [3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] free cooling, [19][20][21][22] electronics cooling, [23][24][25][26][27][28][29][30][31][32][33][34] solar water heating, [35][36][37][38][39][40][41][42] solar power generation, [43][44][45][46][47][48][49] and waste heat utilization. [50][51][52][53][54]…”

Section: Technology Of Latent Heat Storage For High Temperature Applimentioning

confidence: 99%

Technology of Latent Heat Storage for High Temperature Application: A Review

2010

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Table 2. Thermophysical properties of proposed PCM candidates-sugar alcohol, molten salt, and metallicwith phase-changing point over 100°C.from steelworks 2) has more enthalpy at lower temperature but more exergy at a higher temperature over 100°C. Table 3 lists frequently selected keywords from the collected papers. Papers on LHS and PCM frequently used general keywords such as "phase-change material", "PCM", "thermal energy storage", and "latent heat". Apart from these, interestingly, "solar energy" was also frequently used; these papers dealt with PCMs that can store solar energy through melting for various utilities. Keywords such as "phase-change composites", "thermal conductivity", "shape-stabilized" should be noteworthy in that these are related to general problems encountered during the use of PCMs, that is, capsulation and low thermal conductivity. Recent Advancements in LHS Technology PCM CapsulesGenerally, because LHS mainly utilizes the phase change between solid and liquid, the encapsulation of the PCM is necessary to avoid the leakage of a liquid PCM. In addition, Regin et al. 70) noted the functions and requirements of PCM containment: (i) meeting the requirements of strength, flexibility, corrosion resistance, and thermal stability; (ii) acting as a barrier to protect the PCM from harmful interactions with the environment; (iii) providing a sufficient surface for heat transfer, and (iv) providing structural stability and easy handling. PCM capsules are classified into macroand microcapsules.Macrocapsules are the most conventional PCM capsules, and many papers have reported various shell materials such as metal and plastics, and various shapes such as spherical [71][72][73][74][75] and cylindrical. 72,[76][77][78] In contrast, micro-encapsulation of PCM has recently attracted considerable attention [79][80][81][82][83][84][85] because it reduces the reactivity of the PCMs with the outside environment, increases the heat transfer area of the PCMs, and enables the core material to withstand frequent changes in the volume of the storage material during phase change. Table 4 lists trends in manufacturing methods for PCM capsules. Many papers have reported the production of various microcapsules, and the manufacturing methods, core PCM materials, shell materials, thermophysical properties, and capsule sizes of the same have been studied. Micro-interfacial polymerization, 80) in-situ polycondensation, [81][82][83][84][85] and complex coacervation 79) are the most popular microen- ISIJ International, Vol. 50 (2010), No. 9 79,80) 1232© 2010 ISIJ proposed the encapsulation of spherical metal PCMs such as Cu and Pb with an electroplated Ni layer to recover industrial hightemperature waste heat such as combustion offgas. The PCM spherical capsule with Ni coverage provided hybrid functions of both heat storage and catalysis. Nickel worked well as a catalyst of the gas phase reaction CH 4 ϩH 2 Oϭ 3H 2 ϩCO at 1000°C.In summary, the encapsulation of low-temperature PCMs is a state-of-the-art technology; in p...

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Cooling of mobile electronic devices using phase change materials

Cited by 313 publications

References 2 publications

Numerical Analysis of Shell-and-Tube Type Latent Thermal Energy Storage Performance with Different Arrangements of Circular Fins

Numerical Analysis of Shell-and-Tube Type Latent Thermal Energy Storage Performance with Different Arrangements of Circular Fins

Active cooling of a mobile phone handset

Technology of Latent Heat Storage for High Temperature Application: A Review

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