Copper nanowires embedded in boron nitride nanosheet-polymer composites with enhanced thermal conductivities for thermal management

Yin, Chuan-Gen; Liu, Zhongjie; Mo, Rui; Fan, Jinchen; Shi, Penghui; Xu, Qing

doi:10.1016/j.polymer.2020.122455

Cited by 42 publications

(16 citation statements)

References 43 publications

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“…Flexible thermal conducting polymers, due to their unique flexibility and stable thermal conduction network, can still maintain good thermal conduction performance when subjected to tensile and bending stress. They were considered to overcome many weaknesses of traditional thermal conducting polymers and are widely used as thermal interface materials [ 6 , 7 , 8 , 9 , 10 ]. Polydimethylsiloxane (PDMS) is often used as the matrix material of thermal interface materials because of its excellent properties, such as flexibility, low cost, chemical inertness, water resistance, and flame retardant [ 10 , 11 , 12 , 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

“…They were considered to overcome many weaknesses of traditional thermal conducting polymers and are widely used as thermal interface materials [ 6 , 7 , 8 , 9 , 10 ]. Polydimethylsiloxane (PDMS) is often used as the matrix material of thermal interface materials because of its excellent properties, such as flexibility, low cost, chemical inertness, water resistance, and flame retardant [ 10 , 11 , 12 , 13 , 14 ]. However, the intrinsic thermal conductivity of PDMS (about 0.2 W·m −1 ·K −1 ) is not ideal to meet the needs of the electronic industry [ 15 , 16 , 17 , 18 , 19 ].…”

Section: Introductionmentioning

confidence: 99%

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Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Huang

Drummer

et al. 2021

Polymers

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In this work, polydimethylsiloxane (PDMS)-based composites with high thermal conductivity were fabricated via a three-dimensional hybrid boron nitride@silver nanowires (BN@AgNWs) filler thermal network, and their thermal conductivity was investigated. A new thermal conductive BN@AgNWs hybrid filler was prepared by an in situ growth method. Silver ions with the different concentrations were reduced, and AgNWs crystallized and grew on the surface of BN sheets. PDMS-based composites were fabricated by the BN@AgNWs hybrid filler added. SEM, XPS, and XRD were used to characterize the structure and morphology of BN@AgNWs hybrid fillers. The thermal conductivity performances of PDMS-based composites with different silver concentrates were investigated. The results showed that the thermal conductivity of PDMS-based composite filled with 20 vol% BN@15AgNWs hybrid filler is 0.914 W/(m·K), which is 5.05 times that of pure PDMS and 23% higher than the thermal conductivity of 20 vol% PDMS-based composite with BN filled. The enhanced thermal conductivity mechanism was provided based on the hybrid filler structure. This work offers a new way to design and fabricate the high thermal conductive hybrid filler for thermal management materials.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Huang

Drummer

et al. 2021

Polymers

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“…Yin et al [93] used 1D copper nanowires (CuNWs) and boron nitride nanosheets (BNNS) as hybrid fillers to construct a thermal network (Figure 4b). The amino functionalized boron nitride nanosheets (f-BNNS) were obtained from melt modification and liquid-phase exfoliation.…”

Section: Nanoparticle Modificationmentioning

confidence: 99%

Section: Thermal Conduction Pathway Constructionmentioning

confidence: 99%

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Development and Challenges of Thermal Interface Materials: A Review

Yuan

Hussien

et al. 2021

Macro Materials & Eng

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With the development of electronic equipment components in the direction of integration, miniaturization, and intelligence, their increasingly high heat dissipation requirements pose a high challenge to the thermal conductivity (TC) of thermal interface materials (TIMs). Polymer-based composite materials with high TC have gradually been favored because of their good processing performance, low cost, and low density. It is important to summarize the relationship between the problems of low heat conduction and their solutions in relation to polymer-based composite materials. For this purpose, this review comprehensively discusses the basic mechanisms of heat transfer inside polymer-based TIMs, the current challenges, and future prospects for improving TC. Strategies involving surface modification and network construction can reduce interfacial thermal resistance and enhance heat conduction.

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Multifunctional Thermally Conductive Composite Films Based on Fungal Tree‐like Heterostructured Silver Nanowires@Boron Nitride Nanosheets and Aramid Nanofibers

Han

Ruan

2022

Angewandte Chemie

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Thermal conduction for electronic equipment has grown in importance in light of the burgeoning of 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics and extensive mechanical properties. In this work, "solvothermal & in situ growth" method is carried out to prepare "Fungal tree"-like hetero-structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) thermally conductive fillers. The thermally conductive AgNWs@BNNS/ANF composite films are obtained by the method of "suction filtration self-assembly and hotpressing". When the mass fraction of AgNWs@BNNS is 50 wt%, AgNWs@BNNS/ANF composite film presents the optimal thermal conductivity coefficient of 9.44 W/(m • K) and excellent tensile strength of 136.6 MPa, good temperature-voltage response characteristics, superior electrical stability and reliability, which promise a wide application potential in 5G electronic devices.

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Copper nanowires embedded in boron nitride nanosheet-polymer composites with enhanced thermal conductivities for thermal management

Cited by 42 publications

References 43 publications

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Development and Challenges of Thermal Interface Materials: A Review

Multifunctional Thermally Conductive Composite Films Based on Fungal Tree‐like Heterostructured Silver Nanowires@Boron Nitride Nanosheets and Aramid Nanofibers

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