Copper oxidation and surface copper oxide stability investigated by pulsed field desorption mass spectrometry

Cocke, D. L.; Chuah, Gaik‐Khuan; Kruse, Norbert; Block, J.H.

doi:10.1016/0169-4332(94)00467-6

Cited by 57 publications

(24 citation statements)

References 44 publications

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“…On the contrary, earlier studies4346 had reported that CuO was more stable than Cu 2 O. This conflicting result of the present study might be attributed to the fact that, while the Cu 2 O would start to decompose at relatively low temperature (450 K)47, its transformation was suppressed by the rapid cooling provided by the bulk electrolyte, resulting in higher amount of Cu 2 O as compared to that of CuO.…”

Section: Resultscontrasting

confidence: 99%

Soft plasma electrolysis with complex ions for optimizing electrochemical performance

Kamil

Kaseem

2017

Sci Rep

107

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Plasma electrolytic oxidation (PEO) was a promising surface treatment for light metals to tailor an oxide layer with excellent properties. However, porous coating structure was generally exhibited due to excessive plasma discharges, restraining its performance. The present work utilized ethylenediaminetetraacetic acid (EDTA) and Cu-EDTA complexing agents as electrolyte additives that alter the plasma discharges to improve the electrochemical properties of Al-1.1Mg alloy coated by PEO. To achieve this purpose, PEO coatings were fabricated under an alternating current in silicate electrolytes containing EDTA and Cu-EDTA. EDTA complexes were found to modify the plasma discharging behaviour during PEO that led to a lower porosity than that without additives. This was attributed to a more homogeneous electrical field throughout the PEO process while the coating growth would be maintained by an excess of dissolved Al due to the EDTA complexes. When Cu-EDTA was used, the number of discharge channels in the coating layer was lower than that with EDTA due to the incorporation of Cu2O and CuO altering the dielectric behaviour. Accordingly, the sample in the electrolyte containing Cu-EDTA constituted superior corrosion resistance to that with EDTA. The electrochemical mechanism for excellent corrosion protection was elucidated in the context of equivalent circuit model.

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Section: Resultscontrasting

confidence: 99%

Soft plasma electrolysis with complex ions for optimizing electrochemical performance

Kamil

Kaseem

2017

Sci Rep

107

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“…This is consistent with the previous studies that copper oxide formed at room temperature in air consists of copper ͑I͒ oxide, Cu 2 O. [17][18][19] The Cu and Cu 2 O have a very close binding energy, with a difference of 0.1 eV, and cannot be resolved in our XPS spectrum. However, these peaks can be seen from the LMM Auger transitions shown in the inset in Fig.…”

Section: ͑Received 27 December 2002; Accepted 23 April 2003͒supporting

confidence: 93%

“…The activation energy of cation migration in oxide is lowered by 1/2qaE, where q is the charge of the carrier, a is the jump distance, and E is the field strength. 18,27 The barrier height for cation injection into the oxide is also lowered. The process of field-enhanced metal ion injection into the oxide and field-enhanced cation migration continues as long as the field is present.…”

Section: ͑Received 27 December 2002; Accepted 23 April 2003͒mentioning

confidence: 99%

Field-induced cation migration in Cu oxide films by in situ scanning tunneling microscopy

Singh

Wang

2003

Applied Physics Letters

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“…The bonded pairs are sealed completely at this point with no gaps detected at the interface. Behavior with temperature At 200°C, the copper oxide becomes thermo dynamically unstable [27]. Its diffusion along the bonding interface is observed and diffusion bonding can happen.…”

Section: Room Temperaturementioning

confidence: 99%

(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Cioccio¹,

Gueguen²,

Taibi³

et al. 2010

ECS Trans.

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An overview of the different metal bonding techniques used for 3D integration is presented. Key parameters such as surface preparation, temperature and duration of annealing, achievable wafer-to-wafer alignment and electrical results are reviewed. A special focus is done on direct bonding of patterned metal/dielectric surfaces. A mechanism for copper direct bonding is proposed based on bonding toughness measurements, XRR, XRD and TEM analysis. Dedicated characterization techniques for such bonding are presented.

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Copper oxidation and surface copper oxide stability investigated by pulsed field desorption mass spectrometry

Cited by 57 publications

References 44 publications

Soft plasma electrolysis with complex ions for optimizing electrochemical performance

Soft plasma electrolysis with complex ions for optimizing electrochemical performance

Field-induced cation migration in Cu oxide films by in situ scanning tunneling microscopy

(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

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