2014
DOI: 10.1016/j.surfcoat.2013.12.005
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Copper–tin electrodeposition from an acid solution containing EDTA added

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Cited by 30 publications
(15 citation statements)
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“…The main difference among the diffractograms of the DC and SPC electrodeposited Cu-Sn coatings is the presence of a small diffraction peak at 2θ ~ 36.60 o in the DC coatings produced only under the conditions of Experiments 2 and 3 (Figure 5A). This peak could be associated with the intermetallic phase Cu 3 Sn (0.20.0) (PDF n° 01-1240), which has already been observed for Cu-Sn electrodeposited coatings 11,52 . It is also interesting to observe that the relationship between the intensity of the Cu 6 Sn 5 (132) line and that of the steel substrate at 2θ ~ 44.50 o increases for the SPC coatings compared to the DC ones suggesting that more crystalline coatings were produced by pulsed current electrodeposition.…”
Section: Phase Analysissupporting
confidence: 55%
“…The main difference among the diffractograms of the DC and SPC electrodeposited Cu-Sn coatings is the presence of a small diffraction peak at 2θ ~ 36.60 o in the DC coatings produced only under the conditions of Experiments 2 and 3 (Figure 5A). This peak could be associated with the intermetallic phase Cu 3 Sn (0.20.0) (PDF n° 01-1240), which has already been observed for Cu-Sn electrodeposited coatings 11,52 . It is also interesting to observe that the relationship between the intensity of the Cu 6 Sn 5 (132) line and that of the steel substrate at 2θ ~ 44.50 o increases for the SPC coatings compared to the DC ones suggesting that more crystalline coatings were produced by pulsed current electrodeposition.…”
Section: Phase Analysissupporting
confidence: 55%
“…The incorporation of oxides or hydroxides may occur because, at these electrodeposition potentials, the HER occurs in parallel with reduction of the Cu(II), Sn(II), and Zn(II) complex species. As a consequence, pH at the metal/solution interface rises and the oxides or hydroxides of these ions may precipitate [37,45,46]. Also, it can be inferred from the results shown in Table 1 that, when electrodeposits were produced at E d −0.82 V from 0.10Cu 2+ /0.10Sn 2+ / 0.10Zn 2+ bath, the Cu-Sn co-deposition was normal, i.e., a higher percentage of Cu (more noble metal) was present in the final electrodeposit [1,47,48].…”
Section: Study Of the Chemical Solutionmentioning
confidence: 99%
“…Some alternative complexing agents already tested in brass electrodeposition are glycerol [4,5], glycine [1,3], sorbitol [6,7], ethylenediaminetetraacetic acid (EDTA) [8,9], citrate [10], pyrophosphate [11], pyrophosphate-oxalate [12], triethanolamine [2], glucoheptonate [13], nitrilotriacetic acid [14], tartrate [15], choline acetate [16], bis(trifluoromethylsulfonyl)imide [17] and d-mannitol [18]. Among them, EDTA is interesting since it is widely used as a complexing agent in the electrodeposition of metals [19,20] and for separating cations using electrodialysis, exploiting a difference in the solubility constants of the complexes [21,22].…”
Section: Introductionmentioning
confidence: 99%