Copper Wire Bonding Concerns and Best Practices

Chauhan, Preeti; Zhong, Zhang; Pecht, Michael

doi:10.1007/s11664-013-2576-1

Cited by 79 publications

(22 citation statements)

References 56 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Hence, in-depth first ball bonding should be characterized to minimize underneath silicon cratering phenomenon with Cu wirebonding. Key Cu wirebonding process developments and ongoing reliability monitoring have been laid out extensively to address those technical barriers to replace Au wirebonding in semiconductor packaging (Appelt et al, 2011;Zhong, 2009;Chauhan et al, 2013;Liu et al, 2012). Hiew et al (2012) disclosed detailed study on the challenges of development of a robust Cu wire bond process on thin Al bond pad (0.8-m thick) to meet Automotive Electronics Council Grade 1 (AECG1) requirements.…”

Section: Cu Wirebondingmentioning

confidence: 99%

See 1 more Smart Citation

Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Gan¹,

Francis²,

Chan

et al. 2014

Microelectronics International

View full text Add to dashboard Cite

Purpose -The purpose of this paper is to provide a systematic review on technical findings and discuss the feasibility and future of gold (Au) wirebonding in microelectronics packaging. It also aims to study and compare the cost, quality and wear-out reliability performance of Au wirebonding with respect to other wire alloys such as copper (Cu) and silver (Ag) wirebonding. This paper discusses the influence of wire type on the long-term reliability tests. Design/methodology/approach -Literature reviews are conducted based on cost and wire selections of Au, Cu or Ag wirebonding. Detailed wear-out failure findings and wire selection with cost considerations are presented in this review paper. The future and the status of Au wirebonding in microelectronics packaging are discussed in this paper. Findings -This paper briefly reviews selected aspects of the Au ball and other alternative bonding options, focusing on reliability performance, and discusses the future of Au wirebonding in the near future in semiconductor packaging. Practical implications -The paper reveals the technical considerations when choosing the wire types for future microelectronics packaging. Originality/value -The in-depth technical review and strategies of the selection of wire types (Au, Cu or the latest Ag alloy) in microelectronics packaging are discussed in this paper based on previous literature studies.

show abstract

Section: Cu Wirebondingmentioning

confidence: 99%

“…The primary source of corrosion is the moisture content and the presence of halide element, Cl Ϫ content in packaging material (Uno, 2011;Boettcher et al, 2010;Yamaji et al, 2011;Tai et al, 2012;Zeng et al, 2013). As alluded to earlier, it is not an easy plug-and-play to switch from Au wirebonding to Cu wirebonding.…”

Section: Cu Wirebondingmentioning

confidence: 99%

Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Gan¹,

Francis²,

Chan

et al. 2014

Microelectronics International

View full text Add to dashboard Cite

show abstract

“…This involves significant efforts from the point of view of process development, material development, industrialization and reliability. Although Cu wire has been shown to have some advantages like a lower electrical resistance [1] and slower growth of intermetallic compound (IMC) [2], which could potentially provide better reliability at higher temperatures, Cu wire also has several weaknesses. Cu is harder than Au, sometimes leading to damage below the bond for certain bond pad structures [3] and the CuAl IMC region is known to be more sensitive to corrosion, which poses a serious reliability risk.…”

Section: Introductionmentioning

confidence: 99%

Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests

Mavinkurve¹,

Goumans²,

O'Halloran³

et al. 2014

Microelectronics Reliability

View full text Add to dashboard Cite

“…Recently, copper wire bonding appears to be the alternate materials and various engineering studies on copper wire development have been reported [1]. Technical barriers and reliability challenges of Cu wire bonding in microelectronics packaging are well identified [2][3][4][5][6][7][8][9][10][11]. Au-Al microstructure evolution and intermetallic compound (IMC) formation is widely studied by Karpel et al [12].…”

Section: Introductionmentioning

confidence: 99%

Evolution and investigation of copper and gold ball bonds in extended reliability stressing

Gan

Francis²,

Chan³

et al. 2014

Gold Bull

View full text Add to dashboard Cite

This paper discusses the microstructure evolution of copper (Cu) and gold (Au) ball bonds after various extended reliability stresses such as biased highly accelerated temperature and humidity test (HAST), unbiased highly accelerated temperature and humidity test (UHAST), temperature cycling (TC), and high temperature storage life (HTSL) in BGA package. Objective of this study is to study the microstructure evolution and changes after long hours and long cycles of component reliability stressing and its predicted failure mechanisms and to determine the long-term reliability comparison with combination of bonding wires in HAST, UHAST, and TC. Secondary electron microscopy (SEM) and energy dispersive X-ray (EDX) have been carried out to understand the respective microstructure of failed samples in HAST, UHAST, TC, and HTSL long-term reliability failures. Respective failure mechanisms of copper and gold ball bonds carrion under HAST and UHAST, ball bond lifting in TC and HTSL have been analyzed and proposed. The evolution of surface morphology, including copper and gold ball bond micro cracking, gold ball bond Kirkendall microvoiding and intermetallic compound (IMC) formation, was studied in FBGA package with copper and gold ball bonds during various reliability stresses. Biased HAST, UHAST, TC, and HTSL mechanisms were proposed to explain the observed morphological changes and the resulting ball bond wear out modes after extended reliability stresses. Weibull reliability analyses have been established to compare the performance of copper and gold ball bonds under humid and dry environmental tests.

show abstract

Copper Wire Bonding Concerns and Best Practices

Cited by 79 publications

References 56 publications

Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests

Evolution and investigation of copper and gold ball bonds in extended reliability stressing

Contact Info

Product

Resources

About