Coreless substrates status

Appelt, Bernd K.; Su, Bruce; Lai, Yi‐Shao; Huang, Alex S.F.

doi:10.1109/eptc.2010.5702690

2010 12th Electronics Packaging Technology Conference 2010

DOI: 10.1109/eptc.2010.5702690

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Coreless substrates status

Bernd K. Appelt¹,

Bruce Su

Yi‐Shao Lai

et al.

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“…6 On the other hand, sol-gel derived oxycarbosilane homopolymers exhibited significantly higher stiffness and fracture resistance as compared to traditional organosilicates. 11,12 Since it is projected that the mechanical properties of low-k materials are a key requirement for future IC device integration, [14][15][16][17] we decided to take these materials from a lab curiosity to an actual semiconductor manufacturing grade formulation.…”

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confidence: 99%

A Manufacturing Grade, Porous Oxycarbosilane Spin-On Dielectric Candidate with K ≤ 2.0

Volksen

Magbitang

Miller

et al. 2011

J. Electrochem. Soc.

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Ultra low-k porous (k = 2.4) materials are currently used for microelectronic applications. Future device generations require even lower dielectric constants, i.e. higher porosity. For highly porous systems, processing damage and mechanical properties are of great concern. Regarding the latter, sol-gel derived, spin-on oxycarbosilane homopolymers exhibit significantly higher stiffness and fracture resistance as compared to traditional organosilicates. Unfortunately, traditional sol-gel formulations show poor long-term solution stability. This presents a serious limitation to their use in manufacturing. In this paper, we describe the development of a stable, manufacturing grade spin-on formulation (k = 2.0) that meets all the other integration requirements.

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mentioning

confidence: 99%

A Manufacturing Grade, Porous Oxycarbosilane Spin-On Dielectric Candidate with K ≤ 2.0

Volksen

Magbitang

Miller

et al. 2011

J. Electrochem. Soc.

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A 94-GHz Dual-Polarized 1-D Series-Fed Phased Array Antenna With Low Sidelobe Level Based on Multilayer Coreless ABF Substrates

Wang,

Hui Xia,

Fan

et al. 2024

IEEE Trans. Compon., Packag. Manufact. Technol.

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Coreless substrates status

Cited by 2 publications

References 2 publications

A Manufacturing Grade, Porous Oxycarbosilane Spin-On Dielectric Candidate with K ≤ 2.0

A Manufacturing Grade, Porous Oxycarbosilane Spin-On Dielectric Candidate with K ≤ 2.0

A 94-GHz Dual-Polarized 1-D Series-Fed Phased Array Antenna With Low Sidelobe Level Based on Multilayer Coreless ABF Substrates

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