In this letter, the effect of the work function difference between various top electrodes (TE-Ni, W, Ti, and Al) and the Pt bottom electrode, M , on the resistive switching (RS) of SiN thin films was investigated. The cells with W and Ti TEs showed stable RS, but others failed to show RS. In particular, the Ti TE exhibited low operating currents (∼2 μA) and good retention properties (< ∼10 4 s at 85°C). On the basis of the analysis of conduction mechanisms, it is found that stable RS of SiN films might be strongly related to the activation energy of traps induced by M . Thus, the RS properties of the SiN films can be improved by engineering M without additional processes.Index Terms-Activation energy of traps, resistive random access memories (RRAM), resistive switching, silicon nitride, work function difference.