Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu-XNi Solder Alloys in 3.5% NaCl Solution

Mohanty, Udit Surya; Lin, Kwang Lung

doi:10.1007/s11664-012-2452-4

Cited by 25 publications

(13 citation statements)

References 37 publications

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“…On scanning in the anodic direction from point B (Figure 1), the current density rapidly increased due to active dissolution of Sn (Mohanty & Lin 2013). As the electrode potential of both Ag (0.799 V) and Cu (0.337 V) are higher than that of Sn (-0.136 V), Sn works as an anode resulting in its dissolution.…”

Section: Resultsmentioning

confidence: 99%

“…The test methods followed in the present study have similarity with the tests conducted by (Asaduzzaman et al 2011;Mohanty & Lin 2013;Nazeri & Mohammad 2016;Witte et al 2006). Duplicate tests were performed under identical testing conditions to verify reproducibility.…”

Section: Electrochemical Measurementsmentioning

confidence: 99%

“…Additionally, the presence of Ag 3 Sn phase in the solders being nobler than Sn accelerates the dissolution of Sn due to galvanic corrosion (Rosalbino et al 2008). This active dissolution of Sn continues with an increase to a maximum current density up to point C until the hydroxide or oxide concentration reaches to this maximum value (Mohanty & Lin 2013). According to Mohanty and Lin (2007a), solid oxide precipitates on the electrode surface when the solubility product of the tin oxide is exceeded at the anode surface.…”

Section: )mentioning

confidence: 99%

“…After polarization up to critical current density, different solder alloys show degradation of the surface at different level. It is believed that due to corrosion at critical current density, the surface gets supersaturated with oxides and different corrosion compounds (Mohanty & Lin 2013). Corrosion rate could be high due to dissolution of these compounds partially or completely in solution.…”

Section: )mentioning

confidence: 99%

“…Though Sn-Ag solder exhibits better mechanical properties, the melting temperature is not as low as Sn-Pb solders which necessitates the addition of other alloying elements to form ternary or higher order solder alloys. For lowering the melting temperature and improving mechanical and wetting properties, attempts have been made by systematic addition of elements as third or higher order (Mohanty & Lin 2013;Rosalbino et al 2008).…”

Section: Introductionmentioning

confidence: 99%

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Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Fayeka¹,

Haseeb²,

Fazal³

2017

JSM

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Sn-Ag based solder alloy seems to be a promising lead-free solder for the application on electronic assembly. The corrosion behavior of different lead free solder alloys such as Aloi pateri berasaskan Sn-Ag berpotensi menjadi pateri bebas-Pb untuk diaplikasikan sebagai pemasangan elektronik. Tindak balas kakisan aloi pateri bebas Pb yang berbeza seperti dikaji dalam larutan 3.5% NaCl menggunakan upaya dinamik pengutuban dan spektroskopi impedans elektrokimia. Mikroskop imbasan elektron (SEM), spektroskopi sinar-X tenaga terserak (EDX) dan pembelauan sinar-X (XRD) telah digunakan

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Section: Resultsmentioning

confidence: 99%

Section: Electrochemical Measurementsmentioning

confidence: 99%

Section: )mentioning

confidence: 99%

Section: )mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Fayeka¹,

Haseeb²,

Fazal³

2017

JSM

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A comparative study on corrosion failure analysis of hearing aid devices from different markets

Yadav¹,

Ambat

2022

Materials & Corrosion

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The vulnerability of hearing aid devices to corrosion is critical due to their exposure to various kinds of ionic contaminants from the human body, such as sweat, sebum, and so forth, and harsh climatic conditions such as high temperature, humidity, and atmospheric pollutants. The device failure rate will vary depending upon the type of geographical location at which the device is used and root cause failure analysis is a crucial tool to understand the effect of geographical location on corrosion failures. In this study, field failed hearing aid devices from Europe, the United States, and Japan markets were investigated using a scanning electron microscope and elemental dispersive spectroscopy to locate failure mechanisms and causes. Information from the analysis was used for statistical analysis to compare the performance of the devices in the three markets based on failure percentage and failure probability for different parts and components. Solder terminals, battery contacts, light‐emitting diodes, and wireless‐link coil showed consistent and high failure probability across all three markets, whereas a higher failure rate for microphones was found in Europe and the United States market as compared to the Japanese market. The majority of the components corrosion failures occurred in the presence of high chloride ions from human sweat and the atmospheric conditions, whereas potassium hydroxide from the leakage of Zn–air battery was found as the additional cause for microphone failure.

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Evaluation of cooling rate on electrochemical behavior of Sn–0.3Ag–0.9Zn solder alloy in 3.5 wt% NaCl solution

Wang

Gao

Liu

et al. 2014

J Mater Sci: Mater Electron

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Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu-XNi Solder Alloys in 3.5% NaCl Solution

Cited by 25 publications

References 37 publications

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

A comparative study on corrosion failure analysis of hearing aid devices from different markets

Evaluation of cooling rate on electrochemical behavior of Sn–0.3Ag–0.9Zn solder alloy in 3.5 wt% NaCl solution

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