Cost-Effective Optical Sub-Assembly Using Lens-Integrated Surface-Emitting Laser

Suzuki, Takanori; Adachi, K.; Takei, Amane; Tamura, K.; Nakanishi, Akira; Naoe, Kazuhiko; Ohtoshi, T.; Nakahara, K.; Tanaka, S.; Uomi, K.

doi:10.1109/jlt.2015.2477501

Cited by 9 publications

(3 citation statements)

References 11 publications

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“…This can be overcome by optimized single TIR surfaces, possibly in combination with refractive surfaces for beam shaping, by cascaded TIR surfaces, by resist materials with higher refractive index, or by reflective coatings. Nevertheless, the demonstrated coupling losses are already now significantly lower than those obtained for similar structures such as horizontal-cavity surface-emitting lasers 32 (HCSEL) that may be complemented by monolithically integrated lenses 33 to reduce laser-to-fiber coupling losses to 4.9 dB. Alternatively, mirror elements can be attached to the facet of a SMF, e.g., for coupling of light to and from a VCSEL, see In general, reflection at a single dielectric interface can be reduced by using a smaller refractive index contrast.…”

Section: Experimental Verification and Discussionmentioning

confidence: 99%

In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

et al. 2018

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Hybrid photonic integration exploits complementary strengths of different material platforms, thereby offering superior performance and design flexibility in comparison to monolithic approaches. This applies in particular to multi-chip concepts, where components can be individually optimized and tested on separate dies before integration into more complex systems. The assembly of such systems, however, still represents a major challenge, requiring complex and expensive processes for high-precision alignment as well as careful adaptation of optical mode profiles. Here we show that these challenges can be overcome by in-situ nano-printing of freeform beam-shaping elements to facets of optical components. The approach is applicable to a wide variety of devices and assembly concepts and allows adaptation of vastly dissimilar mode profiles while considerably relaxing alignment tolerances to the extent that scalable, cost-effective passive assembly techniques can be used. We experimentally prove the viability of the concept by fabricating and testing a selection of beam-shaping elements at chip and fiber facets, achieving coupling efficiencies of up to 88 % between an InP laser and an optical fiber. We also demonstrate printed freeform mirrors for simultaneously adapting beam shape and propagation direction, and we explore multi-lens systems for beam expansion. The concept paves the way to automated fabrication of photonic multi-chip assemblies with unprecedented performance and versatility.

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Section: Experimental Verification and Discussionmentioning

confidence: 99%

In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

et al. 2018

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“…In 2016, Hitachi Ltd. [67] continued their innovative streak by developing a costeffective optical subassembly (OSA) that utilizes lens-integrated surface-emitting lasers (LISELs) for high-speed optical interconnection. The LISEL µ platform comprises the LISEL and its installation carrier, while the OSA on the silicon-photonics (SiP) platform consists of an external modulator, a grating coupler (GC), and a 3-dB coupler.…”

Section: Mirror-type Hcselmentioning

confidence: 99%

Research Progress of Horizontal Cavity Surface-Emitting Laser

Liu

Song

Chen

et al. 2023

Sensors

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The horizontal cavity surface emitting laser (HCSEL) boasts excellent properties, including high power, high beam quality, and ease of packaging and integration. It fundamentally resolves the problem of the large divergence angle in traditional edge-emitting semiconductor lasers, making it a feasible scheme for realizing high-power, small-divergence-angle, and high-beam-quality semiconductor lasers. Here, we introduce the technical scheme and review the development status of HCSELs. Firstly, we thoroughly analyze the structure, working principles, and performance characteristics of HCSELs according to different structures, such as the structural characteristics and key technologies. Additionally, we describe their optical properties. Finally, we analyze and discuss potential development prospects and challenges for HCSELs.

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“…In order to meet these requirements, we proposed a lens-integrated surface-emitting DFB laser (LISEL) consisting of a DFB laser, integrated mirror, and integrated lens and developed it for a high-capacity and low-cost optical module [13], [14]. By adopting a short cavity DFB structure, we have demonstrated its high-speed operation up to 40Gbps [15].…”

Section: Introductionmentioning

confidence: 99%

A Lens-Integrated Surface-Emitting DFB Laser and Its Application to Cost-Effective Single-Mode Optical Sub Assembly

Adachi

Suzuki

Tanaka

2018

IEICE Trans. Electron.

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A lens-integrated surface-emitting DFB laser and its application to low-cost single-mode optical sub-assemblies (OSAs) are discussed. By using the LISEL, high-efficient optical coupling with reduced number of optical components and non-hermetic packaging are demonstrated. Designing the integrated lens of LISELs makes it possible to achieve passive alignment optical coupling to an SMF without the need for an additional lens. For SiP coupling, the light-emission angle from the LISEL can be controlled by the mirror angle and by displacing the lens. The capability for a low coupling loss of 3.9 dB between the LISEL and a grating coupler on the SiP platform was demonstrated. The LISEL with facet-free structure, integrating DBR mirror, PD, and window structure on its end facet, showed the same lasing performance as the conventional laser with AR facet coating. A storage test (200-hour saturated pressure-cooker test (PCT) at 138 • C and 85% RH.) showed that the lasing characteristics did not degrade with high-humidity, demonstrating the potential for applying non-hermetic packaging. Our results indicate that the LISEL is one of the promising light sources for creating cost-effective OSAs.

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Cost-Effective Optical Sub-Assembly Using Lens-Integrated Surface-Emitting Laser

Cited by 9 publications

References 11 publications

In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

Research Progress of Horizontal Cavity Surface-Emitting Laser

A Lens-Integrated Surface-Emitting DFB Laser and Its Application to Cost-Effective Single-Mode Optical Sub Assembly

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