2013 22nd Asian Test Symposium 2013
DOI: 10.1109/ats.2013.29
|View full text |Cite
|
Sign up to set email alerts
|

Cost-Effective TAP-Controlled Serialized Compressed Scan Architecture for 3D Stacked ICs

Abstract: This paper proposes a cost-effective TAP-controlled serialized compressed scan architecture (SCSA) design to support known-good-die (KGD) test, known-good-stack (KGS) test and post-bond test in the 3D stacked ICs (3D-SICs) configuration. Additionally, a serialized compressed signal generator (SCSG) design is also developed of the proposed scheme to generate the corresponding controlled signals for SCSA to ensure the test cost reduction. Experimental results and comparisons show that the proposed scheme can eff… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2016
2016
2018
2018

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(2 citation statements)
references
References 3 publications
0
2
0
Order By: Relevance
“…In that case, test stimuli need to be transported through other dies in the stack up to the die where they are meant to execute their defect detection work; likewise, test responses need to be transported from the die-under-test through other dies in the stack down to the external stack I/Os. Several ad-hoc 3D-DfT architectures have been proposed [12][13][14][15][16][17][18]; these architectures do their job, but are not fully compatible with each other. However, it is important to guarantee interoperability of the 3D-DfT architecture across the various dies in a stack, even if these dies are designed by different teams or companies; this requires standardization.…”
Section: Ieee Std P1838's Flexible Parallel Port and Its Specificatiomentioning
confidence: 99%
“…In that case, test stimuli need to be transported through other dies in the stack up to the die where they are meant to execute their defect detection work; likewise, test responses need to be transported from the die-under-test through other dies in the stack down to the external stack I/Os. Several ad-hoc 3D-DfT architectures have been proposed [12][13][14][15][16][17][18]; these architectures do their job, but are not fully compatible with each other. However, it is important to guarantee interoperability of the 3D-DfT architecture across the various dies in a stack, even if these dies are designed by different teams or companies; this requires standardization.…”
Section: Ieee Std P1838's Flexible Parallel Port and Its Specificatiomentioning
confidence: 99%
“…We also need novel '3D' DfT structures that provide modular test access from (and to) the external stack I/Os to (and from) the various dies and inter-die interconnect levels, thereby transporting test stimuli and responses up and down through other dies on the way. Several ad-hoc 3D-DfT architectures have been proposed, based on IEEE Std 1149.1 [8] [9], IEEE Std 1500 [10] [11][12][13][14], and on IEEE Std 1687 [15] [16]. These architectures all have their specific strong and weak points.…”
Section: Introductionmentioning
confidence: 99%