Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder

Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification

“…Recently, Ag, Bi or In-containing Sn-Cu alloys have received some attention, and in several prominent reliability test programs Sn-Cu-Ag and Sn-Cu-In alloys demonstrated superior performance, at least in its mechanical strength 20,21 . Tai et al 22 showed that creep resistance of Sn-3.5Ag was improved significantly for Cu particle-reinforced composite solder joints at 25 o C, 65 o C and 105 o C. The tensile strength increased with increasing Bi content in the Sn-Cu eutectic solder alloy, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening 23 . Zhang et al 24 reported that Sn-Bi-Cu alloys were found to have greater wettability than the Sn-Ag-Cu alloy, and it was confirmed that the addition of Bi increases the wettability.…”

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

“…Noh et al [12] used Ce particles as reinforcements for a conventional Sn-Ag solder and reported significant enhancement in wettability and mechanical properties. Tai et al [13] prepared 20 vol% Cu 6 Sn 5 reinforced Sn-3.5Ag composite solder by an in situ method and the composite solder joint exhibited a better steady-state creep strain rate, less thermomechanical fatigue damage and higher shear strengths after different numbers of thermomechanical fatigue cycles as compared to a plain Sn-3.5Ag solder joint. Xiao et al [14] reported that rare earth reinforced Sn-Ag-Cu composite solder suppressed the formation of IMCs and refined the microstructure.…”

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

“…Noh et al [21] used Ce particles as reinforcements for a conventional Sn-Ag solder and reported significant enhancement in wettability and mechanical properties. Tai et al [22] prepared 20 vol.% Cu 6 Sn 5 reinforced Sn-3.5Ag composite solder by an in situ method and the composite solder joint exhibited a better steady-state creep strain rate, less thermomechanical fatigue damage and higher shear strengths after different numbers of thermomechanical fatigue cycles as compared to a plain Sn-3.5Ag solder joint. Recently, Tsao and Chang [23] developed a series of Sn-3.5Ag-0.25Cu composite solders reinforced with different weight percentages (0, 0.25, 0.5 and 1 wt%) of TiO 2 nano-particles and measured their mechanical properties.…”