2015
DOI: 10.1016/j.egypro.2015.03.301
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Cross Testing Electrically Conductive Adhesives and Conductive Back-sheets for the ECN Back-contact Cell and Module Technology

Abstract: ECN set up a cross testing project in which suppliers of electrically conductive adhesives (ECA) and conductive back-sheet (CBS) foils participated. In the component part of the project, combinations of adhesive and foil were characterised for peel strength and contact resistance. The separate components were tested on dot geometry (ECA) and surface structure (CBS). In the module manufacture and testing part, 12 combinations of ECA and CBS were used in 4-cell MWT modules. The modules were tested up to 2000 hou… Show more

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Cited by 10 publications
(7 citation statements)
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“…The contact resistance at the interfaces between fillers is considered to be strongly influenced by the contact stress that is generated due to the shrinkage that occurs during curing of the adhesive binder [10,[23][24][25]. As the curing time increases, the resistance of the ECAs decreased, and the results could be attributed to the phenomenon that the crosslinking reaction of epoxy resin is gradually intensified, and the curing shrinkage leads to an increase in the contact area between the fillers to promote the formation of conductive pathways between the fillers during the curing process [10][11][12]. Silver nanowires have higher activity during curing of the matrix resin due to the high specific surface area of silver nanowires, so they might easily contact the resin, as compared to micro-silver particles.…”
Section: In Situ Monitoring Of the Variations In Electrical Resistancementioning
confidence: 99%
“…The contact resistance at the interfaces between fillers is considered to be strongly influenced by the contact stress that is generated due to the shrinkage that occurs during curing of the adhesive binder [10,[23][24][25]. As the curing time increases, the resistance of the ECAs decreased, and the results could be attributed to the phenomenon that the crosslinking reaction of epoxy resin is gradually intensified, and the curing shrinkage leads to an increase in the contact area between the fillers to promote the formation of conductive pathways between the fillers during the curing process [10][11][12]. Silver nanowires have higher activity during curing of the matrix resin due to the high specific surface area of silver nanowires, so they might easily contact the resin, as compared to micro-silver particles.…”
Section: In Situ Monitoring Of the Variations In Electrical Resistancementioning
confidence: 99%
“…For these modules, reliable contact is required between the CBS and the ECA used to connect the cell metallization to the CBS. Certain combinations CBS-ECA with excellent durability and performance were shown to exist [66,67].…”
Section: New Interconnection and Impact On Metallizationmentioning
confidence: 99%
“…For emerging thin-film and organic solar cells, wide varieties of coloring techniques have been reported, including the use of dyes [33], applying colloidal quantum dots [34], adding photonic filters [35,36], integration with liquid/photonic crystals [37,38], using dielectric mirrors and optical microcavities [39,40], and modifying top or bottom electrodes [41,42].…”
Section: The New Value In Appearancementioning
confidence: 99%