Cryogenic flat-panel gas-gap heat switch

Vanapalli, Srinivas; Keijzer, Ruben; Buitelaar, P.; Brake, H.J.M. ter

doi:10.1016/j.cryogenics.2016.07.006

Cited by 30 publications

(15 citation statements)

References 8 publications

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“…Finally we compare our model with the experimental measurements performed in our lab at ambient [20] and cryogenic [23] temperatures. Let us briefly elaborate on the relevant details of the setup.…”

Section: Discussionmentioning

confidence: 97%

“…For pressures below 100 Pa the gas must be treated as a Knudsen gas. Krielaart et al [20] studied helium, nitrogen and hydrogen gas at room temperature (T m = 294 K), whereas Vanapalli et al [23] studied helium and nitrogen at cryogenic conditions. For the cryogenic measurements the setup was operating at an mean temperature of 117.5 K, resulting in a bulk lower conductivity of the gas, as well as that of the solid compared to the ambient case.…”

Section: Discussionmentioning

confidence: 99%

“…As shown in both references, proper modelling of the full experimental setup required the inclusion of a contact resistance at both sides of the heat switch, see for instance [24]. Graphite foil of 350 µm and thermal paste were added to provide good thermal contact with the segments controlling the hot and cold boundary conditions [23]. To obtain good agreement with the model, the total contact resistance was found to be around 1/(2 × 10 3 ) K/W, which can be estimated using /k c .…”

Section: Discussionmentioning

confidence: 99%

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Thermal Conductance of Interleaving Fins

Limbeek

Vanapalli

2019

Phys. Rev. Applied

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Interleaving fins can significantly increase the heat transfer by increasing the effective area per unit base area. The fins are separated uniformly by a gap, which is filled with a flow medium to control the heat flux. The heat flux between the plates depends strongly on the thermal conductivity of the fin material and the medium between them as well as the dimensions. In earlier studies empirical a fitting method is used to determine the total effectiveness of the fins. However, it required complete characterization of the fins for each new set of operating conditions. In this paper, a simplified analytical model, but still preserving the main physical traits of the problem is developed. This model reveals the dimensionless parameter group containing both material properties and the fin geometry that govern the heat transfer. Rigorously testing of the model using a numerical finite element model shows an accuracy within 2 % over a large parameter space, varying both dimensions and material properties. Lastly, this model is put to test with previously measured experimental data and a good agreement is obtained.

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Section: Discussionmentioning

confidence: 97%

Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

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Thermal Conductance of Interleaving Fins

Limbeek

Vanapalli

2019

Phys. Rev. Applied

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“…The residual powders were successfully removed from all channels, indicating that SLM had the capacity to produce mesoscale hollow internal structures. The 3D-printed compact heat switch that operated at cryogenic temperature was successfully manufactured [ 232 ]. This SLM 3D-printed switch was a compact flat-panel gas–gap heat type with a minimum feature size of 200 μm–500 μm ( Figure 11 c).…”

Section: Powder-based 3d Printing For Fabricating Devices With Micmentioning

confidence: 99%

Powder-Based 3D Printing for the Fabrication of Device with Micro and Mesoscale Features

et al. 2020

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Customized manufacturing of a miniaturized device with micro and mesoscale features is a key requirement of mechanical, electrical, electronic and medical devices. Powder-based 3D-printing processes offer a strong candidate for micromanufacturing due to the wide range of materials, fast production and high accuracy. This study presents a comprehensive review of the powder-based three-dimensional (3D)-printing processes and how these processes impact the creation of devices with micro and mesoscale features. This review also focuses on applications of devices with micro and mesoscale size features that are created by powder-based 3D-printing technology.

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“…different cooling rates can be achieved by varying these two parameters. The heat transfer using thermal diffusion is also used in a gas-gap based heat switch for cryogenic applications [70][71][72]. Now, a further assessment is done to estimate the achievable cooling rates using this approach.…”

Section: Substance Freezing Point At 1 Atm [K]mentioning

confidence: 99%

Cooling dynamics in thermal quenching for cryopreservation

Jagga

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Cryogenic flat-panel gas-gap heat switch

Cited by 30 publications

References 8 publications

Thermal Conductance of Interleaving Fins

Thermal Conductance of Interleaving Fins

Powder-Based 3D Printing for the Fabrication of Device with Micro and Mesoscale Features

Cooling dynamics in thermal quenching for cryopreservation

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