2014 IEEE MTT-S International Microwave Symposium (IMS2014) 2014
DOI: 10.1109/mwsym.2014.6848614
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Cryogenic small-signal and noise performance of 32nm SOI CMOS

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Cited by 42 publications
(20 citation statements)
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“…Such interference is not expected to be an issue in the final quantum computer application thanks to the EMI shielding in the refrigerator. The measured NF translates to an improvement of a ∼10× noise factor at 4 K with respect to 300 K that can be attributed to the large decrease in thermal noise [43]. Measured IIP3 (top) and IIP2 (bottom) at 300 K and 4 K, respectively.…”
Section: Low-noise Amplifier For Spin-qubit Reflectometrymentioning
confidence: 99%
“…Such interference is not expected to be an issue in the final quantum computer application thanks to the EMI shielding in the refrigerator. The measured NF translates to an improvement of a ∼10× noise factor at 4 K with respect to 300 K that can be attributed to the large decrease in thermal noise [43]. Measured IIP3 (top) and IIP2 (bottom) at 300 K and 4 K, respectively.…”
Section: Low-noise Amplifier For Spin-qubit Reflectometrymentioning
confidence: 99%
“…On the contrary, carrier mobility increases, offering higher driving currents [23], and thermal noise is lower, potentially allowing a lower power consumption. However, the noise power spectral density does not scale linearly with temperature and is only expected to be approximately 10× lower at 3 K compared with 300 K [26]. Some devices are not strongly affected by the cryogenic operation, e.g., the thin-film resistors used in this work show negligible change at 5 K compared with 300 K. The capacitance of metal-oxide-metal capacitors and the inductance of on-chip inductors are expected to slightly change at cryogenic temperatures, while the inductor quality factor can double [27].…”
Section: Introductionmentioning
confidence: 99%
“…The design of solid-state electronics at cryogenic temperatures has triggered the need for characterization of active and passive components as required to reliably predict the performance of cryogenic radio-frequency integrated circuits (RFIC) [9]. To some extent, this has been pursued by the scientific community in the case of active devices, which is evident from papers that show DC characterization [10], [11], RF and noise characterization [12], device mismatch [13], [14] of bulk CMOS, as well as DC characterization [15], [16], small-signal and noise characterization [17] of SOI CMOS devices in different technology nodes. In the case of passive devices, cryogenic characterization of off-chip discrete commercial off-the-shelf capacitors and resistors [18], [19] proved that the capacitance/resistance can change drastically at those temperatures depending on the material, thus affecting circuit performance.…”
Section: Introductionmentioning
confidence: 99%